2003
DOI: 10.2172/825347
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Mechanisms of microstructure development at metallic-interlayer/ceramic interfaces during liquid-film-assisted bonding

Abstract: Alumina has been bonded via copper/niobium/copper interlayers, and correlations have been made between various processing conditions (applied load, processing temperature, copper film thickness, surface roughness, etc.) and strength. Four-point bend strengths and micrographs of fracture surfaces have been used to determine the relationship between processing, microstructure, and properties. Transparent sapphire substrates bonded with copper/niobium/copper interlayers were used in model experiments to track the… Show more

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