2020 22nd European Conference on Power Electronics and Applications (EPE'20 ECCE Europe) 2020
DOI: 10.23919/epe20ecceeurope43536.2020.9215897
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Mechanistic Power Module Degradation Modelling Concept with Feedback

Abstract: A platform will be presented based on physics-of-failure-based models. The platform gives an overview of the couplings between simulation, health monitoring and online lifetime prediction of a power module. The platform is modular and is not tied to any specific software product to make it as generally applicable as possible.

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(2 citation statements)
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“…The basic stack-up of a power module, overlaid with a thermal (red) and electrical (blue) networks [36]. The main degrading electrical resistance is named Rbw for the resistance of the bond-wire and the main degrading thermal resistance is named Rth,bw for thermal resistance of the bond-wire.…”
Section: Fig 24mentioning
confidence: 99%
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“…The basic stack-up of a power module, overlaid with a thermal (red) and electrical (blue) networks [36]. The main degrading electrical resistance is named Rbw for the resistance of the bond-wire and the main degrading thermal resistance is named Rth,bw for thermal resistance of the bond-wire.…”
Section: Fig 24mentioning
confidence: 99%
“…Fig. 2.6:Detailed multi-physics map for power device modelling showing the impact of bondwire and die attach damage on thermal and electrical modelling via increasing resistances[36].…”
mentioning
confidence: 99%