Mechanochemical synthesis of Mo–Cu nanocomposite powders

Sun, Aokui; Wang, Dezhi; Wu, Zhuangzhi; Cheng, Qijun

doi:10.1016/j.jallcom.2010.11.019

Cited by 22 publications

(4 citation statements)

References 14 publications

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“…Compared with the CMC composite, since the core material of CPC composite is a Mo70-Cu sheet manufactured by infiltrating Cu into the Mo skeleton uniformly, Cu distributes uniformly on the surface of Mo70-Cu sheet [8]- [10].…”

Section: Bond Mechanismmentioning

confidence: 99%

“…However, the Cu/Mo70-Cu/Cu (CPC) composites, whose core materials are manufactured by infiltrating Cu into Mo skeletons, as recently developed materials, have exhibited better properties than CMC, such as lower density, higher thermal conductivity (TC), and higher bond strength [5]- [7]. Their coefficients of thermal expansion (CTEs) and TC match well with those of Al 2 O 3 , BeO 3 , and other ceramics commonly used in electronics packaging [8]- [10].…”

Section: Introductionmentioning

confidence: 99%

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Combining Diffusion Bonding With Rolling to Manufacture CPC Composites With High Bond Strength for Electronic Packaging Applications

Wang

Yang

et al. 2014

IEEE Trans. Compon., Packag. Manufact. Technol.

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A new technology, which combines diffusion bonding with rolling, was used to manufacture Cu/Mo70-Cu/Cu (CPC) composites for electronic packaging applications. Three samples with different thickness ratios were manufactured. CPC composites with low coefficient of thermal expansion (8.5 × 10 −6 K −1 ), high thermal conductivity (278 W/(m·K)), low density (9.2 g/cm 3 ), and particularly high bond strength (265 MPa) were manufactured. The bond mechanism of CPC composites is a combination of the metallic bond, direct Cu-Cu bonding and surface rupture mechanism. Compared with the traditional processes, CPC composites manufactured by this method have such advantages as high bond strength, controllable thickness ratio, and miniaturization.Index Terms-Bonding strength, Cu/Mo70-Cu/Cu (CPC), diffusion bonding, rolling.

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Section: Bond Mechanismmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Combining Diffusion Bonding With Rolling to Manufacture CPC Composites With High Bond Strength for Electronic Packaging Applications

Wang

Yang

et al. 2014

IEEE Trans. Compon., Packag. Manufact. Technol.

View full text Add to dashboard Cite

show abstract

“…Besides, different requirements of function can be realized by stacking Mo and Cu layers in various orders [1]. Therefore, they are widely used in industrial applications as electrical contacts, electro erosion segments for hard metals and heat sinks for packaging microelectronic devices [2][3][4][5][6][7]. In general, good solid solubility is essential for sound bond properties [8,9].…”

Section: Introductionmentioning

confidence: 99%