Mechanochemical synthesis, thermal stability and selective electrochemical dissolution of Cu–Ag solid solutions

Spassov, Тony; Lyubenova, Lyudmila; Liu, Y.; Bliznakov, Stoyan; Spassova, M.; Dimitrov, Nikolay

doi:10.1016/j.jallcom.2008.12.005

Cited by 27 publications

(21 citation statements)

References 23 publications

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“…If the dissolution of Pb leaves behind a Co sponge with concave surface, the dissolution is expected to occur at a more positive potential than for a flat Co surface. A similar effect was found for metastable Co-Ag alloys [15]. The curvature effect on the dissolution potential has also been described recently with theoretical considerations for nanoparticles [16], obviously with an opposite change of dissolution potential due to their convex surface.…”

Section: Electrodeposition With Two-pulse Platingsupporting

confidence: 77%

Composition, morphology and electrical transport properties of Co–Pb electrodeposits

Neuróhr

Dégi

Pogány

et al. 2012

Journal of Alloys and Compounds

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-Bath compositions were elaborated for the codeposition of Co and Pb by taking into account the chemical compatibility of Co 2+ and Pb 2+ with the appropriate anions. Electrolytes containing either acetate, chloride or nitrate anions were tested, but only the acetate bath proved to be appropriate for the preparation of compact Co-Pb films. Deposits were obtained with constant current, with constant potential or by using various current and potential pulses in order to investigate the possibility of multilayer formation. The variation in deposit composition as a function of the deposition parameters was elucidated by using cyclic voltammetry, current transient measurements and gravimetry. X-ray diffraction (XRD) patterns recorded for two-pulse plated deposits revealed a nanocrystalline structure with grain sizes in the range 5 to 20 nm. The XRD peaks could be well indexed to pure face-centered cubic Co and Pb, indicating that the Pb codeposited with Co is not dissolved in Co but is segregated. Both the d.c.-plated and the two-pulse plated deposits exhibited anisotropic magnetoresistance without an indication for a noticeable giant magnetoresistance contribution. This means that the observed magnetoresistance arises from spindependent electron scattering events dominantly within the sufficiently large Co regions and not along electron paths between two Co regions via the Pb regions. Low-temperature resistivity measurements revealed a superconducting transition slightly below that of pure Pb. This may be ascribed to a proximity effect: the ferromagnetic Co grains suppress somewhat the superconductivity of the Pb phase due to the nanoscale phase mixture of the two constituents.

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Section: Electrodeposition With Two-pulse Platingsupporting

confidence: 77%

Composition, morphology and electrical transport properties of Co–Pb electrodeposits

Neuróhr

Dégi

Pogány

et al. 2012

Journal of Alloys and Compounds

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“…For producing attractive for various applications micro-and nanoporous structures different types of alloys have been used: two-phase crystalline alloys [7,[11][12][13][14][15][16][17][18][19] single phase solid solutions [10,[20][21][22] as well as fine nanocrystalline and amorphous alloys [4][5][6]14,[22][23][24][25][26][27][28][29][30][31][32][33][34][35][36][37][38][39]. To form uniform nanoporosity upon dealloying, an alloy system is required to be a monolithic phase because the nanoporosity is formed by a self-assembly process through surface diffusion, not by the simple excavation of one phase from a pre-separated multiphase system [28].…”

Section: Introductionmentioning

confidence: 99%

“…The results show that the dissolution mechanisms for the cast alloy and the films were strongly dependent on the electrochemical activities of Zr and Cu in each phase. Supersaturated nanocrystalline (16-19 nm) Cu 50 Ag 50 and Cu 70 Ag 30 solid solutions, synthesized by high-energy ball milling, were subjected to electrochemical dealloying [20]. The electrochemical selective dissolution reveals a quasi-critical potential of Cu dissolution in Cu 70 Ag 30 that is shifted 40 mV positively, compared to the dissolution potential of pure Cu.…”

Section: Introductionmentioning

confidence: 99%

Selective dissolution of amorphous Zr–Cu–Ni–Al alloys

et al. 2015

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“…To date, various methods including cold drawing combined with intermediate heat treatments (thermomechanical processing) for Cu/Ag wires [7,8] roll-bonding and subsequent diffusion annealing of Cu and Ag strips [9] thin film deposition [10,11], nonequilibrium processes including rapid quenching, plasma processes [12,13] and severe plastic deformation methods like mechanical alloying [14,15] have been developed for the fabrication of Cu-Ag microcomposites.…”

Section: Introductionmentioning

confidence: 99%