Polymeric materials with high heat resistance and low
dielectric
constants are desired for fast communication. To realize this purpose,
two kinds of silicon-containing main chain type benzoxazines with
and without an acetylene group, (ABA-Si-ala)main and (ABA-Si-a)main, were designed and synthesized from polyphenol oligomers,
primary amines, and paraformaldehyde. Their chemical structures were
characterized and verified by Fourier transform infrared (FTIR) spectra
and nuclear magnetic resonance (NMR) spectra. Moreover, their curing
behaviors and polymerization reactions were studied by differential
scanning calorimetry (DSC) and FTIR spectra, and cross-linking structures
were proposed. Furthermore, thermal properties of the two polybenzoxazines
were analyzed by dynamic mechanical analysis (DMA) and thermogravimetric
analysis (TGA). The results showed that poly(ABA-Si-ala)main exhibited excellent heat resistance and thermal stability, and its T
g and char yield at 800 °C under N2 reached as high as 308 °C and 48.5%, respectively, which
were higher than those of poly(ABA-Si-a)main. In particular,
the existence of the siloxane structure endowed the two polybenzoxazines
with good dielectric properties, and the dielectric constants of poly(ABA-Si-ala)main and poly(ABA-Si-a)main were as low as 2.78
and 2.67 at 1 GHz, respectively. Such low dielectric constants will
be necessary and vital for signal transmission. Therefore, this work
provides a new and effective strategy for designing new polymers with
both excellent heat resistance and low dielectric constants.