Meltable phenylethynyl-capped oligoimide resins derived from 1,4-bis(4-amino-2-trifluoromethylphenoxy)benzene and 3,4′-oxydianiline

Zuo, Hongjun; Chen, Jiansheng; Hu, Aijun; Fan, Lin; Shen, Yang

doi:10.1016/j.eurpolymj.2007.06.009

Cited by 17 publications

(8 citation statements)

References 16 publications

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“…It is deduced that the polyimide resins with high T g and low melt viscosities could be accomplished by introducing of bulky and rigid cardo BAFL groups [23,24] . Additionally, the incorporation of flexible linkage such as ether linkage in ODPA was also an effective pathway to reduce the melt viscosities and ascend the toughness of polymers.…”

Section: Synthesis and Characterization Of The Pepa-oligoimides With mentioning

confidence: 99%

High thermal stable polyimide resins derived from phenylethynyl-endcapped fluorenyl oligoimides with low melt viscosities

Chen

Yang

2016

Chin J Polym Sci

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To improve the processability and thermal stability of polyimide, a series of novel phenylethynyl-endcapped oligoimides (PEPA-oligoimides) with calculated molecular weights (M n C) were successfully prepared from thermal imidization of 4,4'-(9-fluorenylidene) dianiline (BAFL) as fluorenyl diamine, 4,4′-oxy-diphthalic anhydride (ODPA) as aromatic dianhydride and 4-phenylethynylphthalic anhydride (4-PEPA) acted as reactive end-capping reagent at elevated temperatures. Experiment results indicated that the oligoimides were the mixtures of PEPA-endcapped oligomers with different degrees of polymerization characterized by MALDI-TOF mass spectra. The influence of chemical structures on the melt processabilities of the oligoimides, the thermal, dielectric and mechanical properties of the thermoset resins was studied. The typical oligoimide resin owned minimum melt viscosity of 0.2 Pa·s at around 310 C and wide melting processing window, suitable for resin transfer molding (RTM). Besides, its corresponding thermal-cured polyimide resin possessed glass transition temperature (T g ) as high as 514 C. The dielectric constants of polyimide resins decreased from 3.15 to 2.80 by reducing the M n C. The mechanical properties of the polyimide neat resins were improved gradually with increasing M n C. Finally, the carbon fiber/polyimide (C f /PI) composite laminates showed excellent mechanical strength retention rate at 350 C, might be long-term served at extremely high temperature in aerospace and aviation field.

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Section: Synthesis and Characterization Of The Pepa-oligoimides With mentioning

confidence: 99%

High thermal stable polyimide resins derived from phenylethynyl-endcapped fluorenyl oligoimides with low melt viscosities

Chen

Yang

2016

Chin J Polym Sci

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“…As reported, the phenylethynyl-terminated imide oligomers with molecular weight of 5000 g/ mol (PETI-5), had been investigated as a resin matrix by the National Aeronautics and Space Administration, USA, had melt viscosities of 20,500 Pa s (354 C) and 100,000 Pa s (371 C). 44,45 The melt viscosity of PETIs with molecular weight around 5000 g mol À1 was in the range of 191 to 3129 Pa s, 46,47 and the minimum melt viscosities of PETIs, the molecular weight of which was around 10,000 g mol À1 , were 328.1 and 934 Pa s. 48,49 The minimum melt viscosity of PE-HBPI and NE-HBPI was 13.3 and 12.6 Pa s at 309 and 319 C, respectively, where the values were much lower than that of the linear PE-and NE-terminated oligomers. This result could be attributed to the ellipsoidal molecular structure of the hyperbranced polymers.…”

Section: Rheological Propertymentioning

confidence: 98%

Phenylethynyl- and naphthylethynyl-terminated hyperbranched polyimides with low melt viscosity

You

Yao

Zhang

et al. 2015

High Performance Polymers

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In the past decades, 4-phenylethynyl phthalic anhydride has been the most commonly used endcapper for polyimide (PI). A series of different groups of terminated hyperbranched PIs (HBPIs) were synthesized from 1,3,5-tris(2-trifluoromethyl-4-aminophenoxy)benzene, bis[4-(3,4-dicarboxyphenoxy)phenyl]ether dianhydride, and 4-phenylethynylphthalic anhydride or 4-(1-naphthylethynyl)phthalic anhydride. The glass transition temperatures ( Tgs) of the polymers varied from 166°C to 193°C. The 5% weight loss temperatures of polymers were in the range of 548 to 571°C and those of the endcapped HBPIs increased to the range of 600 to 601°C after curing. The PIs exhibited rather low melt viscosity at processing temperature and the complex viscosity increased continuously with the temperature increase. Because there is a large temperature difference between the Tg and cross-linking exothermic temperature, HBPIs provided a wide processing window.

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“…17 From then on, considerable efforts had been made in the field of PETIs for RTM process. Yang et al systematically investigated the PETIs derived from 1,4-bis(4-amino-2-trifluoromethylphenoxy)benzene (1,4,4-6FAPB) with different dianhydrides, such as s -BPDA, 18 a -BPDA, 19 4,4′-oxydiphthalic anhydride, 20,21 and 3,3′,4,4′-diphenylsulfonetetracarboxylic dianhydride. 22…”

Section: Introductionmentioning

confidence: 99%

Phenylethynyl-terminated oligoimides with ultra-low melt viscosity derived from 1,4-bis(3,4-dicarboxy phenoxy)benzene dianhydride

Wang

Chen

Fang

2019

High Performance Polymers

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Most of the existing polyimide oligomers for resin transfer molding (RTM) processing exhibited high melt viscosity, which can only maintain below 1 Pa·s at 280°C for 2 h, leading to very high process temperatures. So novel RTM-type oligomers with lower and stable melt viscosities are more desirable. Three series of thermoset oligoimides derived from 1,4-bis(3,4-dicarboxy phenoxy)benzene dianhydride and three different aromatic diamines were prepared herein. The diamines included 4,4′-oxydianiline, 2,2′-bis(trifluoromethyl)benzidine (TFDB), and 2-phenyl-4,4′-diaminodiphenyl ether ( p-ODA). 4-Phenylethynylphthalic anhydride was used as an endcapping reagent. Effects of the chemical structures and molecular weights of the oligoimides on their aggregated structures, melt processability, and the thermal and mechanical properties of the cured films were then systematically investigated. X-Ray diffraction results indicated that ODA series oligoimides and TFDB series oligoimides showed crystallinity in various degrees. However, the asymmetric p-ODA enables the p-ODA series oligoimides to exhibit amorphous forms. It was found that the p-ODA-based oligoimide with a molecular weight of 750 g mol−1 showed very low melt viscosity of 1 Pa·s even at 210°C, and the melt viscosity could maintain below 1 Pa·s after isothermal aging for 2 h at any temperature in the range of 200–280°C by rheological measurements. The cured film also showed a high glass transition temperature of 355°C by dynamic mechanical analysis, very good thermal stability by thermogravimetric analysis, and good mechanical properties. It might be more suitable for RTM processes in the future.

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Meltable phenylethynyl-capped oligoimide resins derived from 1,4-bis(4-amino-2-trifluoromethylphenoxy)benzene and 3,4′-oxydianiline

Cited by 17 publications

References 16 publications

High thermal stable polyimide resins derived from phenylethynyl-endcapped fluorenyl oligoimides with low melt viscosities

High thermal stable polyimide resins derived from phenylethynyl-endcapped fluorenyl oligoimides with low melt viscosities

Phenylethynyl- and naphthylethynyl-terminated hyperbranched polyimides with low melt viscosity

Phenylethynyl-terminated oligoimides with ultra-low melt viscosity derived from 1,4-bis(3,4-dicarboxy phenoxy)benzene dianhydride

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