Membrane probe with pyramidal tips for a bare chip testing

Kasukabe, Susumu; Mori, Takeshi; Watanabe, Tetsuya; Shigi, Hidetaka; Wada, Y.; Ariga, A.

doi:10.1109/icmcm.1998.670812

Cited by 2 publications

(2 citation statements)

References 2 publications

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“…The average R cont per contact was measured to be 0.5 Ω. This compares favorably with R cont data for comparable probe technologies reported in literature[75][76][77][78][79][80][81][82][83][84][85][86].…”

supporting

confidence: 78%

Probe Module for Wafer-Level Testing of Gigascale Chips With Electrical and Optical I/O Interconnects

Thacker

Ogunsola

Bakir

et al. 2005

Advances in Electronic Packaging, Parts A, B, and C

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The bandwidth provided by optical interconnects makes them an attractive solution for chip-to-package and chip-to-chip communications. In such systems, chips will have optical I/O interconnects fabricated alongside their conventional electrical counterparts. Virtually no work has been previously reported relating to the testing of such chips at the wafer-level. The requirements for probe hardware needed to achieve this are identified, and probe module configurations based on these requirements are presented. A high-density micro-opto-electro-mechanical-systems (MOEMS)-based probe substrate prototype for interfacing with chips having electrical and optical polymer pillar-based I/Os has been designed, and built using microfabrication techniques. Successful probing of an array of polymer pillar-based optical I/Os is reported.

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supporting

confidence: 78%

Probe Module for Wafer-Level Testing of Gigascale Chips With Electrical and Optical I/O Interconnects

Thacker

Ogunsola

Bakir

et al. 2005

Advances in Electronic Packaging, Parts A, B, and C

View full text Add to dashboard Cite

show abstract

“…Preceding research showed that etching selectivity could be effectively used when we make 3-dimensional object [4]. By using etching selectivity, we can fabricate protruding object from a depressed engraving.…”

Section: Fabricationmentioning

confidence: 99%

A curvature controlled flexible silicon micro electrode array to wrap neurons for signal analysis

Kim

Kubota

Higo

et al. 2009

TRANSDUCERS 2009 - 2009 International Solid-State Sensors, Actuators and Microsystems Conference

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A brand-new flexible microelectrodes array device is made with silicon and polymer MEMS technology. The device can "wrap" a single axon of a neuron with uniform curvature radius predefined by the integrated "curvature limiter". The device can measure 3-dimensional potential distribution around the axon surface. By this we are intending to verify if the assumption that an axon works as a 1-dimensional wire is correct or not. This would be the world's first attempt to measure an axon 3-dimensionally.

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Membrane probe with pyramidal tips for a bare chip testing

Cited by 2 publications

References 2 publications

Probe Module for Wafer-Level Testing of Gigascale Chips With Electrical and Optical I/O Interconnects

Probe Module for Wafer-Level Testing of Gigascale Chips With Electrical and Optical I/O Interconnects

A curvature controlled flexible silicon micro electrode array to wrap neurons for signal analysis

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