MEMS based sensors – A comprehensive review of commonly used fabrication techniques

A review of piezoelectric MEMS sensors and actuators for gas detection application

“…Additionally, MEMS are being manufactured using a variety of materials such as semiconductors, biomaterials, nanomaterials, magnetic, piezoelectric, ferroelectric, ceramic, and plastics [11,[21][22][23][24]. In addition, MEMS devices can be used in various applications such as sensors, actuators, switches, inertial sensors including (gyroscopes and accelerometers), optical scanners, miniature robots, micro-mirrors, and many more applications are being developed every day [25][26][27][28][29][30][31][32][33].…”

“…In the last few years, MEMS fabrication technology has grown dramatically to the point that tiny devices can be manufactured to be working as actuators and sensors; therefore, they can be found everywhere from wearable devices to automotive equipment [29,30,34]. The fabrication techniques used in MEMS production combine the capabilities of the techniques that are utilized in the IC domain with the processes of micromachining such as surface micromachining, bulk micromachining, Lithographie Galvanoformung Abformung (LIGA), high-aspect-ratio micromachining (HARM) to wafer bonding and molding, etc.…”

“…The fabrication techniques used in MEMS production combine the capabilities of the techniques that are utilized in the IC domain with the processes of micromachining such as surface micromachining, bulk micromachining, Lithographie Galvanoformung Abformung (LIGA), high-aspect-ratio micromachining (HARM) to wafer bonding and molding, etc. [30]. MEMS CAP Inc., USA, is one of the famous companies that provides MEMS fabrication facilities for researchers through multiusers MEMS procedures (MUMPs) including several standard fabrication procedures such as MetalMUMPs [35], PolyMUMPs [36], SOIMUMP [37], and PiezoMUMPs [38], whereas there are hundreds of other fabs in the global who are fabricating MEMS devices, just to mention some, including SilTerra [39][40][41], Infineon [42], CEA-LETI [43,44], CSEM [45], TSMS [46,47], and Bosh [48,49].…”

Recent Progress in the Topologies of the Surface Acoustic Wave Sensors and the Corresponding Electronic Processing Circuits

“…Then, a combination of microelectromechanical (MEMS) and CMOS technology is required to successfully integrate the SAW element and the integrated electronic circuits for signal-data processing [7]. In any case, the overall cost for fabrication of the SAW-based sensor devices is relatively low, as compared to other sensors relying on more precise and expensive microfabrication processes [8]. A common view of the SAW element with a piezoelectric substrate or coating is shown in Figure 1.…”

“…In this way, the large-sca SAW elements is made compatible with the CMOS technology, ex not based on the piezoelectric-crystal substrate. Then, a combination chanical (MEMS) and CMOS technology is required to successfully element and the integrated electronic circuits for signal-data proces the overall cost for fabrication of the SAW-based sensor devices compared to other sensors relying on more precise and expensive m cesses [8]. A common view of the SAW element with a piezoelectric is shown in Figure 1.…”