MEMS Process by Film Transfer Using Fluorocarbon Anti-Adhesive Layer

Abstract

A low cost and low temperature MEMS transfer process is presented. The process is based on adhesion control of molded electroplated Ni microstructures on donor wafer by using plasma deposited fluorocarbon film. Adhesive bonding of the microstructures on the target wafer using BCB sealing enables mechanical tearing out from the donor wafer. This proposed process has allowed us to realize from 7 µm down to 700 nm thick Ni patterns on Si, Pyrex glass wafers and Kapton foils. Multiple transfers lead to Ni stacked microstructures. Because this process is simple and only involves a low temperature (250°C) heating of the host wafer, it is highly versatile and suitable for various applications and brings new perspectives towards 3D integration of MEMS/NEMS.