MEMS sensor with giant piezoresistive effect using metall-semiconductor hybrid structure

Ngo, Ha-Duong; Tekin, Tolga; Fritz, Mark; Kurniawan, W.; Mukhopadhyay, Biswajit; Kolitsch, A.; Schiffer, Michael; Lang, Klaus‐Dieter

doi:10.1109/transducers.2011.5969160

Cited by 4 publications

(6 citation statements)

References 11 publications

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“…Therefore, we have focused on obtaining S-N plots with narrower deviation by using out-of-plane bending vibration of a very thin membrane without patterning to reveal the intrinsic fatigue characteristics of silicon accurately [18,19]. Actually, it is incorrect to apply the reported fatigue properties of the etched beams for the lifetime prediction of membrane MEMS devices such as pressure sensors [20], microphones [21] and tunable filters [22] whose membrane thickness are often submicrometer, since they use a membrane structure without etched sidewalls. In our testing method, the specimen has a circular weight and multilayered membrane consisting of polysilicon of sub-micrometer thickness as the test material, SiO 2 and Si 3 N 4 to designate the fracture origins on the top surface of the polysilicon film and to control the resonant frequency.…”

Section: Introductionmentioning

confidence: 99%

Fatigue characteristics of polycrystalline silicon thin-film membrane and its dependence on humidity

Tanemura

Yamashita

Wado

et al. 2013

J. Micromech. Microeng.

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This paper describes fatigue characteristics of a polycrystalline silicon thin-film membrane under different humidity evaluated by out-of-plane resonant vibration. The membrane, without the surface of sidewalls by patterning of photolithography and etching process, was applied to evaluate fatigue characteristics precisely against the changes in the surrounding humidity owing to narrower deviation in the fatigue lifetime. The membrane has 16 mm square-shaped multilayered films consisting of a 250 or 500 nm thick polysilicon film on silicon dioxide and silicon nitride underlying layers. A circular weight of 12 mm in diameter was placed at the center of the membrane to control the resonant frequency. Stress on the polysilicon film was generated by deforming the membrane oscillating the weight in the out-of-plane direction. The polysilicon film was fractured by fatigue damage accumulation under cyclic stress. The lifetime of the polysilicon membrane extended with lower relative humidity, especially at 5%RH. The results of the fatigue tests were well formulated with Weibull's statistics and Paris’ law. The dependence of fatigue characteristics on humidity has been quantitatively revealed for the first time. The crack growth rate indicated by the fatigue index decreased with the reduction in humidity, whereas the deviation of strength represented by the Weibull modulus was nearly constant against humidity.

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Section: Introductionmentioning

confidence: 99%

Fatigue characteristics of polycrystalline silicon thin-film membrane and its dependence on humidity

Tanemura

Yamashita

Wado

et al. 2013

J. Micromech. Microeng.

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“…Four pins are drawn from the silicon piezoresistive strip for connecting with metal pads. The outer two pins are used for constant The equivalent series resistance R ES (σ, n p , T) of aluminum-silicon hybrid structure of the sensor at different working stress (σ) and temperature (T) as well as doping concentration (n p ) can be expressed as [16][17][18][31][32][33]:…”

Section: Principle Of Composite Sensor Chipmentioning

confidence: 99%

“…When external tire pressure is exerted on the top surface of the sensor, as shown in figure 1, the main stress σ along the Y-axis direction corresponds to the [110] crystal direction will change the longitudinal and transverse resistivity, which are related to initial resistivity ρ 0 (n p , T) and piezoresistive coefficients [16,18]. Thus, the tensile strains along the width of aluminum-silicon hybrid structure due to pressure can deflect the current away from the aluminum shunt on account of this stress-induced anisotropy in the silicon conductivity [15][16][17][18]. This is principle of tire pressure measurement of composite sensor utilizing aluminum-silicon hybrid structure.…”

Section: Principle Of Composite Sensor Chipmentioning

confidence: 99%

“…However, it is very difficult to mass-manufacture these new structures and materials. It is worth noting that Rowe et al proved high-sensitivity MEMS pressure sensors can be achieved based on aluminum-silicon hybrid structure [15][16][17][18]. Moreover, this hybrid structure may also be used as a temperature sensor because its resistivity and piezoresistive coefficient change with temperature [18].…”

Section: Introductionmentioning

confidence: 99%

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Development of MEMS composite sensor with temperature compensation for tire pressure monitoring system

Zhang

Wang

Xie

et al. 2021

J. Micromech. Microeng.

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The pressure and temperature inside the tire is mainly monitored by the tire pressure monitoring system (TPMS). In order to improve the integration of the TPMS system, moreover enhance the sensitivity and temperature-insensitivity of pressure measurement, this paper proposes a microelectromechanical (MEMS) chip-level sensor based on stress-sensitive aluminum–silicon hybrid structures with amplified piezoresistive effect and temperature-dependent aluminum–silicon hybrid structures for hardware and software temperature compensations. Two types of aluminum–silicon hybrid structures are located inside and outside the strained membrane to simultaneously realize the measurement of pressure and temperature. The model of this composite sensor chip is firstly designed and verified for its effectiveness by using finite element numerical simulation, and then it is fabricated based on the standard MEMS process. The experiments indicate that the pressure sensitivity of the sensor is between 0.126 mV/(V·kPa) and 0.151 mV/(V·kPa) during the ambient temperature ranges from −20 °C to 100 °C, while the measurement error, sensitivity and temperature coefficient of temperature-dependent hybrid structures are individually ±0.91 °C, −1.225 mV/(V °C) and −0.150% °C−1. The thermal coefficient of offset (TCO) of pressure measurement can be reduced from −3.553%FS °C−1 to −0.375%FS °C−1 based on the differential output of the proposed sensor. In order to obtain the better performance of temperature compensation, Elman neural network based on ant colony algorithm is applied in the data fusion of differential output to further eliminate the temperature drift error. Based on which, the overall measured error is within 3.45 kPa, which is less than ±1.15%FS. The TCO is −0.017%FS °C−1, and the thermal coefficient of span is −0.020%FS °C−1. The research results may provide a useful reference for the development of the high-performance MEMS composite sensor for the TPMS system.

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“…There are a number of MEMS devices that use a membrane structure such as pressure sensors, microphones and tunable filters. [12][13][14] For the lifetime prediction of these membrane devices, it is difficult to apply the reported reliability properties. Therefore, we have proposed and demonstrated a novel mechanical reliability testing method, dedicated to evaluating very thin membranes without patterning of the specimens.…”

Section: Introductionmentioning

confidence: 99%

Fatigue Testing of Polycrystalline Silicon Thin-Film Membrane Using Out-of-Plane Bending Vibration

Tanemura

Yamashita

Wado

et al. 2012

Jpn. J. Appl. Phys.

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This paper describes a new fatigue testing method for polycrystalline-silicon (polysilicon) thin-film membrane to evaluate its mechanical reliability not affected by surface roughness of etched sidewalls. The test specimen is a thin membrane consisting of polysilicon, silicon dioxide, and silicon nitride films with a circular weight at the center, and its outer edge is supported by a square frame. Stress on polysilicon for fatigue test is applied by deformation of the membrane generated by oscillating the weight in the out-of-plane direction near the resonant frequency. The polysilicon film fractured by fatigue damage accumulated by the cyclic stress. Stress and number of cycles to fracture (S–N) plots were well formulated on the basis of Weibull statistics and Paris' law. Weibull modulus and fatigue index of the 250-nm-thick polysilicon film were 19.2 and 21.8, respectively. These parameters make it possible to predict the lifetime of polysilicon thin-film membrane under arbitrary cyclic stress.

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MEMS sensor with giant piezoresistive effect using metall-semiconductor hybrid structure

Cited by 4 publications

References 11 publications

Fatigue characteristics of polycrystalline silicon thin-film membrane and its dependence on humidity

Fatigue characteristics of polycrystalline silicon thin-film membrane and its dependence on humidity

Development of MEMS composite sensor with temperature compensation for tire pressure monitoring system

Fatigue Testing of Polycrystalline Silicon Thin-Film Membrane Using Out-of-Plane Bending Vibration

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