“…An effective approach for reducing the interfacial resistance is to increase the electrode-electrolyte interface area. In this regard, micro-patterning processes based on conventional ceramic technologies-such as powder metallurgy [18], spray deposition of YSZ particles [19], and mesh pressing of tape-casted sheets [20,21]-have been developed. Alternatively, advanced processing techniques-such as atmospheric plasma spraying [22], thermal spray [23], micropowder imprinting method [24], inkjet printing techniques [25,26], lithography [27,28] and stereolithography [29,30]-allowed us to obtain highly complex electrode-electrolyte interfaces with excellent control and reproducibility.…”