Meso-scale low-cycle fatigue damage of polycrystalline nickel-based alloy by crystal plasticity finite element method

Long, Xu; Chong, Kainan; Su, Yuezeng; Chang, Chao; Zhao, Liguo

doi:10.1016/j.ijfatigue.2023.107778

Cited by 95 publications

(3 citation statements)

References 66 publications

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“…Consider that the efficiency of material processing is influenced not only by external factors. The authors [45] of the article have illustrated that comprehending the interplay between meso-scale and macro-scale structures is essential to enhance the effectiveness of abrasive films in surface smoothing applications.…”

Section: Analysis Of Processed Surfaces Using Lapping Filmsmentioning

confidence: 99%

Morphology of Microchips in the Surface Finishing Process Utilizing Abrasive Films

Tandecka,

Kacalak,

Wiliński

et al. 2024

Materials

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In this study, the surface of new lapping films was analyzed, and the lapping finishing process was applied to RG7 tin bronze alloy. The research focused on examining lapping films with electrocorundum grains of nominal sizes 30, 12, and 9 μm, commonly used for achieving smooth surfaces. The manufacturing process involves placing abrasive grains and binder onto a polyester tape, resulting in a heterogeneous distribution of abrasive grains. The study investigates the impact of this random distribution on the performance of lapping films during material removal. Scanning electron microscopy was used to analyze the surface structure of abrasive films, revealing distinctive structures formed by the specific aggregation of abrasive grains. This study explores the influence of different nominal grain sizes on surface finish and aims to optimize lapping processes for diverse applications. The research also delves into microchip analysis, examining the products of the lapping film finishing process. Microchips were observed directly on the abrasive tool surface, revealing insights into their morphology and distribution. The chip segmentation frequency was determined, and they amounted to approximately 0.8 to 3 MHz; these are very high frequencies, which are unique for known chip-forming processes.

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Section: Analysis Of Processed Surfaces Using Lapping Filmsmentioning

confidence: 99%

Morphology of Microchips in the Surface Finishing Process Utilizing Abrasive Films

Tandecka,

Kacalak,

Wiliński

et al. 2024

Materials

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“…The above Equations ( 1)-( 12) [23][24][25] are the fundamental equations governing crystal deformation dynamics. These equations establish the correlation between the slip shear rate and the macroscopic deformation rate.…”

Section: Kinematic Equationmentioning

confidence: 99%

Numerical Simulation of the Residual Stress at the Interface between Thermal Barrier Coating and Nickel-Based Single-Crystal Superalloy Based on Crystal Plasticity Theory

Liu,

Wang,

Yang

et al. 2023

Coatings

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Residual stress plays an important role in the formation and growth of cracks in thermal barrier coatings and single-crystal superalloy substrates. In this study, a finite element model for a planar double-layer thermal barrier coating and a crystal plasticity finite element model based on dislocation slip-induced plastic deformation of single-crystal materials were established to analyze the residual stress in the coatings and the substrate, considering the creep and crystal plasticity of the substrate materials. The simulation results show that the thermal barrier coatings bear most of the stress generated by high temperatures, and the residual stress of the substrate is small. By comparing the two material properties to calculate the interface stress when the amplitude of the interface between the substrate and the coating is 30 μm and the thickness of the thermal grown oxide layer is 5 µm, the interfacial stress of the substrate at the macro scale was found to be similar to the interfacial stress at the micro slip system scale. Based on the cumulative shear strain, it was determined that the [001]-, [011]-, and [111]-oriented alloys activated the 12, 8, and 4 groups, respectively, under the combined action of thermal stress and centrifugal force of the coating. Comparing the activation of different initial orientation slip systems and the magnitude of the yield stress provides a theoretical foundation to study the structural integrity of single-crystal alloys.

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“…With the help of various special properties of quasicrystal materials, scientists have made new breakthroughs in various research fields, which has also promoted the development of quasicrystal material applications. Different from ordinary crystals [1][2][3], the two-dimensional decagonal quasicrystals are periodic in the direction of the decagonal rotational symmetry axis, while the arrangement of plane atoms perpendicular to the decagonal rotational symmetry axis is quasi-periodic, which leads to the additional elastic degrees of freedom that do not exist in ordinary crystals and increases the complexity of fracture mechanics research. The quasicrystal phase of the electron diffraction pattern with 10 rotationally symmetric axes was found by Bendersky [4].…”

Section: Introductionmentioning

confidence: 97%

A Closed-Form Solution to the Mechanism of Interface Crack Formation with One Contact Area in Decagonal Quasicrystal Bi-Materials

Zhang,

et al. 2024

Crystals

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Cracks and crack-like defects in engineering structures have greatly reduced the structural strength. An interface crack with one contact area in a combined tension–shear field of decagonal quasicrystal bi-material is investigated. Based on the deformation compatibility equation and displacement potential function, the complex representation of stress and displacement is given. Using the mixed boundary conditions, the closed-form expressions for the stresses and the displacement jumps in the phonon field and phason field on the material interface are obtained. The results show that the stress intensity factor at the crack tip is zero for the phason field. The variation in the stress intensity factor and the length of the contact zone in the phonon field is given, and the result is consistent with the properties of the crystal. The design of safe engineering structures and the formulation of reasonable quality acceptance standards may benefit from the theoretical research carried out here.

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Meso-scale low-cycle fatigue damage of polycrystalline nickel-based alloy by crystal plasticity finite element method

Cited by 95 publications

References 66 publications

Morphology of Microchips in the Surface Finishing Process Utilizing Abrasive Films

Morphology of Microchips in the Surface Finishing Process Utilizing Abrasive Films

Numerical Simulation of the Residual Stress at the Interface between Thermal Barrier Coating and Nickel-Based Single-Crystal Superalloy Based on Crystal Plasticity Theory

A Closed-Form Solution to the Mechanism of Interface Crack Formation with One Contact Area in Decagonal Quasicrystal Bi-Materials

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