Mesoscopic Self-Assembly: A Shift to Complexity

Mastrangeli, Massimo

doi:10.3389/fmech.2015.00006

Cited by 5 publications

(3 citation statements)

References 57 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…In contrast, the self‐assembly of biological structures is a multilevel process occurring at various length scales such as the assembly of amino‐acid chains into peptides and then into proteins which are finally formed into complex functional architectures to form viruses, cellular membranes, organelles, and molecular machines (Figure b). The self‐assembly in biological systems possesses stability, fail safety, recovery mechanisms, and reproducibility, which highlights its great potential and offers a general strategy for the creation of complex functional 3D components at larger scales …”

Section: Mesoscopic Self‐assemblymentioning

confidence: 99%

Shapeable Material Technologies for 3D Self‐Assembly of Mesoscale Electronics

Karnaushenko

Kang

Schmidt

2019

Adv Materials Technologies

View full text Add to dashboard Cite

simple transistors and logics to highly integrated microcontrollers and displays, the latter of which utilizes some of the most technologically advanced processes available in the industry. [3] The success of these technologies has been achieved through enhanced integration of various active functional blocks such as transistors, digital logics, and analog circuits, along with advances in miniaturization and simplification of the overall manufacturing process, eventually leading to large scale, parallel fabrication of silicon chip-based microelectronic components and systems. [4,5] However, many of the manufacturing steps in assembling these electronic components remain either semiparallel or sequential in nature, including processes as dicing, pick and place, packaging, and final assembly of the device. Each additional sequential step increases costs and should ideally be avoided, however substantial streamlining is not always feasible in complex manufacturing processes. [6] More critically, highly integrated silicon-based devices still require several external supporting components for their operation such as wiring, powering, sensing, and communications that cannot be easily integrated within the planar surface of a silicon die. Thus, sensors, actuators, capacitors, coils, antennas, and optics, each crucial for the complete system, are typically placed separately from the silicon chip onto a printed circuit board (PCB), or integrated within another package (Figure 1a). While the need for ever decreasing sizes has demanded tremendous investments and efforts in the manufacture of completed assemblies, the miniaturizing of 3D electronic components (Figure 1b) and systems has nevertheless reached the range of mesoscopic sizes (<1 mm) where the manufacture and assembly of components experience challenges with respect to yield, costs, and reliability. [7] As a result, these issues limit the fabrication potential and commercial viability of components and systems to scales around 1 mm, [8] and despite efforts to improve the planar construction of mesoscopic 3D devices, the results are seen as inefficient and experience difficulties in achieving high performances while maintaining reasonable complexity. Despite the great success in manufacturing active electronics, such concerns are strongly related to the fabrication of passive electronic components like inductors, capacitors, antennas, and resonators where material properties (e.g., mechanical, magnetic, and electrical) and geometry play a crucial role. [8,9] In order to downscale these devices further and improve integration with active electronics, novel fabrication strategies are required.Electronic devices and their components are continually evolving to offer improved performance, smaller sizes, lower weight, and reduced costs, often requiring the state-of-the-art manufacturing and materials to do so. An emerging class of materials and fabrication techniques inspired by self-assembling biological systems shows promise as an alternative to the more traditional m...

show abstract

Section: Mesoscopic Self‐assemblymentioning

confidence: 99%

Shapeable Material Technologies for 3D Self‐Assembly of Mesoscale Electronics

Karnaushenko

Kang

Schmidt

2019

Adv Materials Technologies

View full text Add to dashboard Cite

show abstract

“…Shapeable ultrathin materials (33) allow for 3D self-driven spatial rearrangement of sensors on the wafer scale that has the potential to considerably simplify fabrication. Shape transformation becomes a vital strategy in constructing compact, complex 3D mesoscopic systems, where conventional technologies have been shown to be inadequate (34)(35)(36)(37)(38). Motivated by its compatibility with established microfabrication technologies, self-folding and rolling of ultrathin 2D patterned membranes of various materials have attracted special attention among a number of self-assembly processes (36) to build robots (39), drug delivery scaffolds (40), passive electronic components (41)(42)(43), sensors (41,(44)(45)(46), electronics (47), and microsurgery (48) tools.…”

Section: Introductionmentioning

confidence: 99%

“…Shape transformation becomes a vital strategy in constructing compact, complex 3D mesoscopic systems, where conventional technologies have been shown to be inadequate (34)(35)(36)(37)(38). Motivated by its compatibility with established microfabrication technologies, self-folding and rolling of ultrathin 2D patterned membranes of various materials have attracted special attention among a number of self-assembly processes (36) to build robots (39), drug delivery scaffolds (40), passive electronic components (41)(42)(43), sensors (41,(44)(45)(46), electronics (47), and microsurgery (48) tools. Applied on rigid substrates, novel organic and inorganic shapeable materials that have been micropatterned in a planar fashion are capable of self-assembly into diverse 3D mesoscopic architectures including polyhedral (49), cylindrical (50,51), and more complex (52) shapes.…”

Section: Introductionmentioning

confidence: 99%

Self-assembly of highly sensitive 3D magnetic field vector angular encoders

et al. 2019

View full text Add to dashboard Cite

Novel robotic, bioelectronic, and diagnostic systems require a variety of compact and high-performance sensors. Among them, compact three-dimensional (3D) vector angular encoders are required to determine spatial position and orientation in a 3D environment. However, fabrication of 3D vector sensors is a challenging task associated with time-consuming and expensive, sequential processing needed for the orientation of individual sensor elements in 3D space. In this work, we demonstrate the potential of 3D self-assembly to simultaneously reorient numerous giant magnetoresistive (GMR) spin valve sensors for smart fabrication of 3D magnetic angular encoders. During the self-assembly process, the GMR sensors are brought into their desired orthogonal positions within the three Cartesian planes in a simultaneous process that yields monolithic high-performance devices. We fabricated vector angular encoders with equivalent angular accuracy in all directions of 0.14°, as well as low noise and low power consumption during high-speed operation at frequencies up to 1 kHz.

show abstract