Metal/ceramic joining.

Elssner, G.; Petzow, G.

doi:10.2355/isijinternational.30.1011

Cited by 135 publications

(64 citation statements)

References 2 publications

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“…Korn et al cite an ≈200°C reduction in processing temperature when equal bonding pressures are used [35]. 4 aluminum to the ambient. The hardness and yield stress of niobium increase approximately linearly with oxygen content [41], ' and bonds produced at ≥1600°C (or that use niobium intentionally doped with oxygen [42]) have undesirable properties [29].…”

Section: Dissolution Of Alumina; Oxygen and Aluminum Diffusionmentioning

confidence: 99%

“…As a result, the difference in the amount of liquid formed at 1150°C versus 1400°C is negligible. 4 Although equilibration with a low ambient p O 2 could reduce the strength of copper/alumina interfaces, the equilibrium concentration of dissolved oxygen in copper is orders of magnitude lower than that in niobium at constant oxygen potential. Thus, under most conditions niobium would "getter" oxygen from copper.…”

Section: Effect Of Processing Conditions On Room-temperature Mechanicmentioning

confidence: 99%

“…Of the numerous methods available for ceramic-ceramic and ceramic-metal joining, solid-state diffusion bonding and reactive metal brazing have been most heavily investigated for producing reliable joints for demanding high-stress, hightemperature applications [1][2][3][4][5]. Diffusion bonding and brazing have unique advantages, but also liabilities that increase in number and severity as processing temperatures are increased.…”

Section: Introductionmentioning

confidence: 99%

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Joining of alumina via copper/niobium/copper interlayers

et al. 2000

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Alumina has been joined at 1150°C and 1400°C using multilayer copper/niobium/copper interlayers. Four-point bend strengths are sensitive to processing temperature, bonding pressure, and furnace environment (ambient oxygen partial pressure). Under optimum conditions, joints with reproducibly high room temperature strengths (≈240 ± 20 MPa) can be produced; most failures occur within the ceramic. Joints made with sapphire show that during bonding an initially continuous copper film undergoes a morphological instability, resulting in the formation of isolated copper-rich droplets/particles at the sapphire/interlayer interface, and extensive regions of direct bonding between sapphire and niobium. For optimized alumina bonds, bend tests at 800°C-1100°C indicate significant strength is retained; even at the highest test temperature, ceramic failure is observed. Postbonding anneals at 1000°C in vacuum or in gettered argon were used to assess joint stability and to probe the effect of ambient oxygen partial pressure on joint characteristics. Annealing in vacuum for up to 200 h causes no significant decrease in room temperature bend strength or change in fracture path. With increasing anneal time in a lower oxygen partial pressure environment, the fracture strength decreases only slightly, but the fracture path shifts from the ceramic to the interface. Cu/Nb/Cu Interlayers R. A. Marks et al. Joining of Alumina via

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Section: Dissolution Of Alumina; Oxygen and Aluminum Diffusionmentioning

confidence: 99%

Section: Effect Of Processing Conditions On Room-temperature Mechanicmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Joining of alumina via copper/niobium/copper interlayers

et al. 2000

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“…The wettability increases, in both cases, with the increase of brazing temperature. The best shear strength results were attained for 316/CB4/Al 2 O 3 joints produced at 850 • C. Moreover, it is evident in different works [18][19][20] that the highest wettability rate does not assures the best mechanical behaviour. Analysing the CB5 shear strength results at 900 and 950 • C one can easily see that those values are higher than the results obtained with CB4.…”

Section: Microstructuresmentioning

confidence: 84%

Microstructure, mechanical properties and chemical degradation of brazed AISI 316 stainless steel/alumina systems

Paiva¹,

Barbosa

2008

Materials Science and Engineering: A

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The main aims of the present study are simultaneously to relate the brazing parameters with: (i) the correspondent interfacial microstructure, (ii) the resultant mechanical properties and (iii) the electrochemical degradation behaviour of AISI 316 stainless steel/alumina brazed joints. Filler metals on such as Ag-26.5Cu-3Ti and Ag-34.5Cu-1.5Ti were used to produce the joints. Three different brazing temperatures (850, 900 and 950 • C), keeping a constant holding time of 20 min, were tested. The objective was to understand the influence of the brazing temperature on the final microstructure and properties of the joints. The mechanical properties of the metal/ceramic (M/C) joints were assessed from bond strength tests carried out using a shear solicitation loading scheme. The fracture surfaces were studied both morphologically and structurally using scanning electron microscopy (SEM), energy dispersive spectroscopy (EDS) and X-ray diffraction analysis (XRD). The degradation behaviour of the M/C joints was assessed by means of electrochemical techniques.It was found that using a Ag-26.5Cu-3Ti brazing alloy and a brazing temperature of 850 • C, produces the best results in terms of bond strength, 234 ± 18 MPa. The mechanical properties obtained could be explained on the basis of the different compounds identified on the fracture surfaces by XRD. On the other hand, the use of the Ag-34.5Cu-1.5Ti brazing alloy and a brazing temperature of 850 • C produces the best results in terms of corrosion rates (lower corrosion current density), 0.76 ± 0.21 Acm −2 . Nevertheless, the joints produced at 850 • C using a Ag-26.5Cu-3Ti brazing alloy present the best compromise between mechanical properties and degradation behaviour, 234 ± 18 MPa and 1.26 ± 0.58 Acm −2 , respectively. The role of Ti diffusion is fundamental in terms of the final value achieved for the M/C bond strength. On the contrary, the Ag and Cu distribution along the brazed interface seem to play the most relevant role in the metal/ceramic joints electrochemical performance.

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“…One class of joining processes, exemplified by diffusion bonding, involves purely solid-state processing [1, [3][4][5][6][7][8][9][10][11][12]. The components to be joined can be brought into direct contact or, as is often the case for ceramic-ceramic joining, a metallic foil can be inserted between the ceramic components.…”

Section: Conventional Joining Approachesmentioning

confidence: 99%