Metal Conductive Surface Patterning on Photoactive Polyimide

Liu, Jing; Li, Minfeng; Yang, Yuzhao; Xu, Lirong; Lin, Jingjing; Hong, Wei; Chen, Xudong

doi:10.1002/adfm.201701674

Cited by 32 publications

(22 citation statements)

References 35 publications

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“…Furthermore, XPS spectra of Pd3d showed two doublet peaks at 335.2 and 340.5 eV (Figure F), which were due to the spin‐orbital splitting of Pd3d 5/2 and Pd3d 3/2 , respectively. These results are in agreement with other reported observation , which confirmed the composition of PdNCs onto nanocomposite structure.…”

Section: Resultssupporting

confidence: 94%

Palladium Nanoclusters Uniformly Enveloped Electrochemically Activated Graphene for Highly Sensitive Hydrogen Peroxide Sensor

et al. 2019

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Nonenzymatic sensors based on a metals nanocomposite with high sensitivity, selectivity, and stability has been received considerable interest. In this study, a novel electrochemical nanocomposite sensor based on palladium nanoclusters (PdNCs) decorated electrochemically activated graphene (EAGr) was established for highly sensitive nonenzymatic H2O2 sensor. The PdNCs/EAGr nanocomposite was fabricated via an electrochemical activation of Gr by the potential cycling in the range of +0.6 to −1.8 V, followed by the electrodeposition of PdNCs at −0.4 V applied potential. The homogeneous dispersion of PdNCs/EAGr nanocomposite were characterized by scanning electron microscopy (SEM), X‐ray photoelectron spectroscopy (XPS), cyclic voltammetry (CV), and linear sweep voltammetry (LSV). The PdNCs/EAGr nanocomposite electrode showed higher electrocatalytic activity towards the reduction of H2O2 in pH 7.0 of 0.1 M PBS by significantly enhancing the reduction peak current and reduced the reduction overpotential as well as eliminated other interfering species responses. The PdNCs/EAGr electrode displayed a wide linear range for H2O2 reduction from 1.0 to 1100 μM with limit of detection 0.02±0.01 μM. The higher sensitivity and selectivity as well as long‐time stability and excellent reproducibility obtained, indicating the proposed sensor is an effective H2O2 based sensor. In addition, the analytical application of the nancomposite sensor was successfully examined for the determination of H2O2 in the real sample of human urine indicating that the appreciable practicality of the nonenzymatic sensor for the determination of H2O2 in physiological fluids.

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Section: Resultssupporting

confidence: 94%

Palladium Nanoclusters Uniformly Enveloped Electrochemically Activated Graphene for Highly Sensitive Hydrogen Peroxide Sensor

et al. 2019

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“…The metallization of polyimides has received particular attention, due to their mechanical strength, biocompatibility, chemical resistance, and ability to withstand high temperatures. Different approaches have been followed to achieve this metallization, such as embedding silver nanowires, decomposing metal–organic compounds or the activation of a palladium seed layer for future plating …”

Section: Introductionmentioning

confidence: 99%

A Rapid Photopatterning Method for Selective Plating of 2D and 3D Microcircuitry on Polyetherimide

Marqués-Hueso

Jones

Watson

et al. 2017

Adv Funct Materials

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In this work, a method for the rapid synthesis of metallic microtracks on polyetherimide is presented. The method relies on the photosynthesis of silver nanoparticles on the surface of the polymer substrates from photosensitive silver chloride (AgCl), which is synthesized directly on the polyetherimide surface. The study reveals that the use of AgCl as a photosensitive intermediate accelerates the reactions leading to the formation of silver nanoparticles by up to two orders of magnitude faster than other photodecomposition schemes. The patterning can be conducted under blue light, with notable advantages over UV exposure. Polymers of significant interest to the microelectronics and 3D printing industries can be directly patterned by light using this photography-inspired technique at throughputs high enough to be commercially advantageous. Light exposures as short as a few seconds are sufficient to allow the direct metallization of the illuminated polyetherimide surface. The results show that the silver required for the seed layer is minimal, and the later copper electroless plating results in the selective growth of conductive tracks for circuitry on the light-patterned areas, both on flexible films and 3D printed surfaces. direct metallization [4] of modified photoresists, [5] which has the advantage that it can be directly patterned by UV photolithography [6] without vacuum process steps for the metal deposition. DOIThe metallization of polyimides has received particular attention, due to their mechanical strength, biocompatibility, chemical resistance, and ability to withstand high temperatures. Different approaches have been followed to achieve this metallization, such as embedding silver nanowires, [7] decomposing metalorganic compounds [8] or the activation of a palladium seed layer for future plating. [9] One proposed methodology for the fabrication of metallic tracks on polyimides is surface modification by ion exchange and subsequent plating. [10] This method has the advantage of avoiding any vacuum processing steps. Moreover, the organometallic bonds can be selectively broken by irradiation, enabling direct light patterning. Finally, the use of a photoresist acting as a mold for electroplating can be removed from the manufacturing process. The nanoparticles (NPs) resulting from the photoreduction of the free metallic ions can then be used as seeds for subsequent plating. This also permits patterning by direct laser writing, [11] which could accommodate the selective plating of contoured, 3D surfaces.This manufacturing process has a plethora of advantages, but its industrial implementation has been held back as the photopatterning stage has been too slow to be implemented for mass production. Moreover, the exposure energy must be limited in order to avoid damage to the polymeric substrate. [12] These limitations have triggered a search for new processes in order to obtain faster nanoparticle formation.One approach has been to use assisted photoreduction of the metallic ions with a mild reducing agent [...

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“…To ensure the stable and high performance of these flexible and wearable electronic systems, it is necessary to find suitable soft electrical conductor, which serves as the transporting channel for the electrical signals to trigger appropriate actions of such devices. Despite an intensive research effort on developing new types of conductive materials such as conducting polymers and carbon nanotubes, metal—the most conventional conductor—still outperforms significantly in terms of the electrical conductivity, device compatibility, materials stability, and cost‐effectiveness . In particular, with the recent understanding of the nanomechanics of the metal and the soft structural design, metal conductors are indispensable for most of the flexible and wearable applications.…”

Section: Introductionmentioning

confidence: 99%

Polymer‐Assisted Metal Deposition (PAMD) for Flexible and Wearable Electronics: Principle, Materials, Printing, and Devices

2019

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such as conducting polymers and carbon nanotubes, metal-the most conventional conductor-still outperforms significantly in terms of the electrical conductivity, device compatibility, materials stability, and cost-effectiveness. [1,[30][31][32][33][34][35][36][37][38] In particular, with the recent understanding of the nanomechanics of the metal and the soft structural design, metal conductors are indispensable for most of the flexible and wearable applications.In the literature, the fabrication of metal conductors typically consists of vacuum deposition of the metal and subsequent patterning with photolithography. Although this fabrication strategy can be directly applied on flexible polymeric substrates, it is often too costly for most flexible applications and may encounter materials instability issues of the flexible substrates at high vacuum or strong solvent. In addition, vacuum technology is not suitable for coating substrates with 3D structures such as foams, fibers, and arbitrary surfaces. This has led to extensive research on developing solution-based metal deposition and printing methods in the past three decades. The most reported solution-based strategy is the so-called "metal ink" method, in which solution-dispersed nanostructured metal particles (including nanoparticles (NPs), nanowires, nanotubes, and nanoplates) or metal precursors are cast or printed onto the flexible substrates and then thermally sintered or chemically reduced to yield the metallic conductors. [39][40][41][42][43] Nevertheless, they are still not widely used because of the following reasons. 1) The metal conductor fabricated through the "metal ink" method shows much lower electrical conductivity compared to their bulk, due to the additives of the ink (such as surfactants, binders, and stabilizers) and the large contact resistance between the NPs. [44,45] 2) The "metal ink" method works very well with noble metals such as Au and Ag, but is not compatible with more frequently used, yet less stable metals such as Cu and Ni. Even though there has been a major shift of research focus from Ag to Cu in recent years, inks for making high-quality Cu or Ni conductors at low-temperature and in the air atmosphere are yet to be developed. 3) The metal conductors made by the "metal ink" method are more suitable for interconnects but are less suitable for electrode applications due to the high roughness and impurity of the metal film. 4) Penetration of the "metal ink" into highly porous substrates or structures with small gaps is The rapid development of flexible and wearable electronics favors low-cost, solution-processing, and high-throughput techniques for fabricating metal contacts, interconnects, and electrodes on flexible substrates of different natures. Conventional top-down printing strategies with metal-nanoparticleformulated inks based on the thermal sintering mechanism often suffer from overheating, rough film surface, low adhesion, and poor metal quality, which are not desirable for most flexible electronic applications. In recent ...

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Metal Conductive Surface Patterning on Photoactive Polyimide

Cited by 32 publications

References 35 publications

Palladium Nanoclusters Uniformly Enveloped Electrochemically Activated Graphene for Highly Sensitive Hydrogen Peroxide Sensor

Palladium Nanoclusters Uniformly Enveloped Electrochemically Activated Graphene for Highly Sensitive Hydrogen Peroxide Sensor

A Rapid Photopatterning Method for Selective Plating of 2D and 3D Microcircuitry on Polyetherimide

Polymer‐Assisted Metal Deposition (PAMD) for Flexible and Wearable Electronics: Principle, Materials, Printing, and Devices

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