1991
DOI: 10.1080/00150199108007937
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Metal-ferroelectric-semiconductor characteristics of bismuth titanate films on silicon

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1992
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Cited by 50 publications
(11 citation statements)
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“…Several techniques such as rf sputtering, 10,11 pulsed laser deposition, 12,13 and electron cyclotron resonance plasma sputtering 14 have been employed to deposit good quality Bi 4 Ti 3 O 12 thin films. In the present case, thin films of Bi 4 Ti 3 O 12 were fabricated using the metalorganic solution deposition ͑MOSD͒ technique.…”
Section: Introductionmentioning
confidence: 99%
“…Several techniques such as rf sputtering, 10,11 pulsed laser deposition, 12,13 and electron cyclotron resonance plasma sputtering 14 have been employed to deposit good quality Bi 4 Ti 3 O 12 thin films. In the present case, thin films of Bi 4 Ti 3 O 12 were fabricated using the metalorganic solution deposition ͑MOSD͒ technique.…”
Section: Introductionmentioning
confidence: 99%
“…Nevertheless, as shown in Fig. 2(d), the widths of the hysteresis loops decrease rapidly at 650 • C. This may be due to that a thinner SiO 2 film is formed at the BTO/Si interface because the Si substrate is easy to be oxidized during the annealing process [20,21]. The SiO 2 layer can distribute a large part of the applied voltage because the dielectric constant of SiO 2 is as low as 3.9.…”
Section: Methodsmentioning
confidence: 88%
“…1. A thin layer of silicon dioxide (SiO 2 ) layer of about 5 nm at the BPrT/Si interface was assumed to be extended during annealing in ambient air [5,6]. The thickness of the top and bottom electrode were both 8 nm.…”
Section: Methodsmentioning
confidence: 99%