Additive
manufacturing (AM) has progressed rapidly in recent years,
thanks to its versatility in printing complex and intricate shapes.
Very recently, it has also been making inroads into functional and
energy materials. On the other hand, thermoelectrics is a relatively
mature field, with well-established understanding and design, especially
on the materials level. However, complexities in device fabrication
and scalability issues have greatly hindered thermoelectric (TE) applications.
In this Focus Review, we discuss the advent of AM as a timely and
important tool not only to overcome the scalability issues but also
to achieve shape intricacies and conformability for flexible and wearable
applications. In particular, direct ink writing (DIW), a subset under
materials extrusion methods, holds great promise as a versatile fabrication
technique for integrated TE devices. More importantly, we discuss
the great promise of “engineered nanostructuring” using
DIW as a new paradigm to improve TE performance beyond intrinsic properties.