Metallic/magnetic Multilayer for Wide-band Direct-on-chip EMI Shielding

Kikitsu, Akira; Kurosaki, Yoshinari; Shirotori, S.; Fujita, Atsushi; Nishigaki, Hisashi; Matsunaka, Shigeki

doi:10.1109/emcsi39492.2022.10050239

2022 IEEE International Symposium on Electromagnetic Compatibility &Amp; Signal/Power Integrity (EMCSI) 2022

DOI: 10.1109/emcsi39492.2022.10050239

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Metallic/magnetic Multilayer for Wide-band Direct-on-chip EMI Shielding

Akira Kikitsu

Yoshinari Kurosaki

S. Shirotori

et al.

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Metallic/magnetic Multilayer for Wide-band Direct-on-chip EMI Shielding

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