“…Many formation methods of FeSi 2 such as MBE, ion implantation, FeSi 2 target sputtering, and so on have been reported (2,3,4). However, lots of issues such as requirement of high-temperature annealing process (usually over 800 o C) and excess carrier concentration (more than 10 18 cm -3 ), and so on still exist (5,6). A stacked sputtered process has been confirmed to form silicide films at relatively low temperature (7).…”