Abstract:Solder-based self-assembly is a method for micromachining three-dimensional structures on silicon. This process has been used for educational purposes due to the significant experience gained by students interested in semiconductor processing. However, patterning the silicon dioxide sacrificial layer, involves handling hazardous materials such as buffered hydrofluoric acid. To provide a safer alternative to this dangerous etchant, we describe a method for using poly(acrylic acid), a water soluble polymer, as a… Show more
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