Method for preparing dispersed crystalline copper particles for electronic applications

Abstract

Dispersed crystalline copper particles were prepared by reacting aqueous dispersions of CuCl with ferrous citrate. We report that the Fe(II) citrate complex can reduce rapidly and completely cuprous chloride to metallic copper and propose a mechanism for the reaction observed. By changing the precipitation conditions, copper particles with sizes varying from 250 nm to 2.0 µm were obtained. The method described represents a simple and versatile approach for preparing copper powders for electronic applications.

Preparation of sub-micrometer Cu particles by green hydrothermal synthesis under air

“…[8][9][10] Given the trend toward increasingly smaller electrodes, the line width of conductive paste regions in printed bezel electrodes has decreased to values below 50 µm, and the size of filler particles such as Cu@Ag particles has been reduced to several micrometers. [11] Moreover, if the printed patterns of conductive paste in the bezel electrodes are required to become even narrower, the particle size must be reduced to approximately one micrometer or less.…”

Synthesis, Characterization, and Formation Mechanism of Crystalline Cu and Ni Metallic Nanowires under Ambient, Seedless, Surfactantless Conditions

“…Corresponding films composed of electrospun Cu NWs have been shown to possess very low resistance and high transmittance properties, while maintaining mechanical flexibility . Not surprisingly, research has been initiated on Cu NWs for a variety of applications including but not limited to solar cells, , touch screens, and light-emitting diodes. − …”

Preparation and characterization of copper nanoparticles surface‐capped by alkanethiols

“…[28] Among the mentioned methods, chemical reduction is a simple synthesis process and can be effectively adopted to control the size and shape of nanostructured Cu. [29][30][31] In the meantime, because Cu nanoparticles are prone to oxidation in the presence of oxygen, it is usually also imperative to introduce surface-capping agents onto the surfaces of nanosized Cu so as to deactivate newly formed inorganic nanoparticles and avoid their oxidation. [32] In this respect, organic compounds such as amine, phosphine, alcohol, thiol, and even acid may be promising surface-capping agents, because they contain functional groups that can interact with metallic surface atoms to prevent the oxidation and agglomeration, allowing control of the size and size distribution of nanoparticles.…”

“…Common methods for preparing copper nanoparticles include hydrothermal or solvothermal method, thermal decomposition method, microemulsion technique, sonochemical reduction method, radiation method, and reverse micelle method . Among the mentioned methods, chemical reduction is a simple synthesis process and can be effectively adopted to control the size and shape of nanostructured Cu . In the meantime, because Cu nanoparticles are prone to oxidation in the presence of oxygen, it is usually also imperative to introduce surface‐capping agents onto the surfaces of nanosized Cu so as to deactivate newly formed inorganic nanoparticles and avoid their oxidation .…”