Method of Dislocation and Bulk Diffusion Parameters Determination

Yarmolenko, M. V.; Str., Ua Cherkasy V. Chornovola

doi:10.15407/mfint.42.11.1537

Cited by 7 publications

(11 citation statements)

References 14 publications

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“…The less temperature is, the higher contribution of grain-boundary diffusion and dislocation pipe diffusion to the layers growth is, so models of grain-boundary diffusion and dislocation pipe diffusion involving outflow into volume should be taken into account [6][7][8].…”

Section: Introductionmentioning

confidence: 99%

Copper, Iron, and Aluminium Electrochemical Corrosion Rate Dependence on Temperature

Yarmolenko¹

2022

Corrosion - Fundamentals and Protection Mechanisms

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Our investigations show that electrochemical corrosion of copper is faster than electrochemical corrosion of aluminium at temperatures below 100°C. Literature data analysis shows that the Al atoms diffuse faster than the Cu atoms at temperatures higher than 475°C, Al-rich intermetallic compounds (IMCs) are formed faster in the Cu-Al system, and the Kirkendall plane shifts towards the Al side. Electrochemical corrosion occurs due to electric current and diffusion. An electronic device working time, for example, depends on the initial copper cover thickness on the aluminium wire, connected to the electronic device, temperature, and volume and dislocation pipe diffusion coefficients, so copper, iron, and aluminium electrochemical corrosion rates are investigated experimentally at room temperature and at temperature 100°C. Intrinsic diffusivities ratios of copper and aluminium at different temperatures and diffusion activation energies in the Cu-Al system are calculated by the proposed methods here using literature experimental data. Dislocation pipe and volume diffusion activation energies of pure iron are calculated separately by earlier proposed methods using literature experimental data. Aluminium dissolved into NaCl solution as the Al3+ ions at room temperature and at temperature 100°C, iron dissolved into NaCl solution as the Fe2+ (not Fe3+) ions at room temperature and at temperature 100°C, copper dissolved into NaCl solution as the Cu+ ions at room temperature, and as the Cu+ and the Cu2+ ions at temperature 100°C. It is found experimentally that copper corrosion is higher than aluminium corrosion, and the ratio of electrochemical corrosion rates, kCu/kAl > 1, decreases with temperature increasing, although iron electrochemical corrosion rate does not depend on temperature below 100°C. It is obvious because the melting point of iron is higher than the melting point of copper or aluminium. It is calculated that copper electrochemical corrosion rate is approximately equal to aluminium electrochemical corrosion at a temperature of about 300°C, so the copper can dissolve into NaCl solution mostly as the Cu2+ ions at a temperature of about 300°C. The ratio of intrinsic diffusivities, DCu/DAl < 1, increases with temperature increasing, and intrinsic diffusivity of aluminium could be approximately equal to intrinsic diffusivity of copper at a temperature of about 460°C.

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Section: Introductionmentioning

confidence: 99%

Copper, Iron, and Aluminium Electrochemical Corrosion Rate Dependence on Temperature

Yarmolenko¹

2022

Corrosion - Fundamentals and Protection Mechanisms

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“…Two phases are formed in the Cu-Sn system during isothermal annealing of Cu/Sn samples at temperature T = 200 o C [3,6,9]: ε-phase Cu3Sn (phase 1, C1 ≈ ¾ = 0.753, ∆C1 = 0.012, C = CCu [6]) and η-phase Cu6Sn5 (phase 2, C2 ≈ 6/11 = 0.547, ∆C2 = 0.021, C = CCu [6]), at temperature T = 210 o C [10], and at temperature T = 250 o C (Sn is liquid) [11]. Parabolic growth constants for the layer thicknesses were measured in [6], also the range of homogeneity of each phase were measured, and the values of the mutual diffusion coefficients for the Cu3Sn (phase 1) and Cu6Sn5 (phase 2) phases between 463 K and 493 K (190 o C and 220 o C) were calculated too: [12] or by "constant flux method" (Gurov's and Gusak's method) [13][14][15][16][17][18][19][20][21][22][23] or by other methods [26,[28][29][30] (data are from [6] as an example):…”

Section: I2 the Cu-sn Systemmentioning

confidence: 99%

Intermetallics Disappearance Rates and Intrinsic Diffusivities Ratios Analysis in the Cu-Zn and the Cu-Sn Systems

Yarmolenko

2021

Phys. Chem. Solid St.

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“…Dislocation pipe and volume diffusion activation energies can be calculated in such a way. The Arrhenius law is valid for dislocation pipe diffusion and volume diffusion in ultra high purity samples [11,19]:…”

Section: Investigation At Temperature 100 O Cmentioning

confidence: 99%

“…A method of dislocation pipe diffusion parameters determination during the type B diffusion kinetics was suggested by model of dislocation pipe diffusion involving outflow [11]. The method involves diffusion dislocation pipe kinetics for two different annealing times at the same temperature during the type B kinetics and dislocation pipe kinetics for one annealing time at other lower temperature during the type C kinetics.…”

Section: Diffusion Activation Energy Calculation In Pure Ironmentioning

confidence: 99%

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Copper, Iron, and Aluminium Electrochemical Corrosion Rates and Intrinsic Diffusivitives Dependence on Temperature Investigations

Mv¹

2021

Preprint

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Our investigations show that electrochemical corrosion of copper is faster than electrochemical corrosion of aluminium at temperatures below 100oC. Literature data analysis shows that the Al atoms diffuse faster than the Cu atoms at temperatures higher than 475oC, Al rich intermetallic compounds (IMCs) are formed faster in the Cu-Al system, and the Kirkendall plane shifts toward Al side. Electrochemical corrosion occurs due to electric current and due to diffusion. An electronic devise working time, for example, depends on initial copper cover thickness on aluminium wire, connected to the electronic devise, temperature, and volume and dislocation pipe diffusion coefficients, so copper, iron, and aluminium electrochemical corrosion rates are investigated experimentally at room temperature and at temperature 100oC. Intrinsic diffusivities ratios of copper and aluminium at different temperatures and diffusion activation energies in the Cu-Al system are calculated by proposed here methods using literature experimental data. Dislocation pipe and volume diffusion activation energies of pure iron are calculated separately by earlier proposed method using literature experimental data. Aluminium dissolved into NaCl solution as the Al3+ ions at room temperature and at temperature 100oC, iron dissolved into NaCl solution as the Fe2+ (not Fe3+) ions at room temperature and at temperature 100oC, copper dissolved into NaCl solution as the Cu+ ions at room temperature and as the Cu+ and the Cu2+ ions at temperature 100oC. It is founded experimentally that copper corrosion is higher than aluminium corrosion, and ratio of electrochemical corrosion rates, kCu/kAl>1, decreases with temperature increasing, although iron electrochemical corrosion rate doesn’t depend on temperature below 100oC. It is obvious, because melting point of iron is more higher then melting point of copper or aluminium. It is calculated that copper electrochemical corrosion rate is approximately equal to aluminium electrochemical corrosion at temperature about 300oC, so copper can dissolve into NaCl solution mostly as the Cu2+ ions at temperature about 300oC. Ratio of intrinsic diffusivities, DCu/DAl <1, increases with temperature increasing, and intrinsic diffusivity of aluminium could be approximately equal to intrinsic diffusivity of copper at temperature about 460oC.

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Method of Dislocation and Bulk Diffusion Parameters Determination

Cited by 7 publications

References 14 publications

Copper, Iron, and Aluminium Electrochemical Corrosion Rate Dependence on Temperature

Copper, Iron, and Aluminium Electrochemical Corrosion Rate Dependence on Temperature

Intermetallics Disappearance Rates and Intrinsic Diffusivities Ratios Analysis in the Cu-Zn and the Cu-Sn Systems

Copper, Iron, and Aluminium Electrochemical Corrosion Rates and Intrinsic Diffusivitives Dependence on Temperature Investigations

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