Method of Parametric Optimization in Problems of Identification of Boundary Conditions of Convective Heat Transfer in Processes of Non-Stationary Heat Conduction

Diligenskaya, A. N.

doi:10.1109/fareastcon.2018.8602677

Cited by 3 publications

(2 citation statements)

References 10 publications

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“…Iligenskaya A.N. [3] Here we discussed a space variable heat transfer coefficient of heat flow condition on nonstationary heat flux. The inverse heat conduction method aims to reduce error up to the range of 0-3%.…”

Section: Heat Transfer Analysismentioning

confidence: 99%

Study of Extrude Aluminum Alloy LED Bulb in a Passive Mode of Cooling System with a Different Array of Fin Structure

Namdeo Pawar,

Nanwala

2024

J. Mater. Eng.

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Nowadays, the world is running behind power generation as well as power saving. In the lighting industry, the L.E.D. bulb is used for lighting purposes. The main problem faced by the world is heat dissipation from a heat sink by active or passive cooling. The system accessories enhance the overall cost by using active cooling. This paper studied that it has been used to reduce the overall cost of L.E.D. bulbs by increasing the heat transfer rate concerning increasing heat transfer coefficient. It needs to understand the various parameters such as porosity, heat transfer rate, laminar flow, density, and heat transfer modes to achieve the above-desired result. Their application is for street lights, gardens, mall parking, and bulging decorative lights. The cross-shape fin array is a suitable replacement with porosity of more than 0.85 for a proper swirl during the cooling time for an active cooling system for an existing bulb.

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Section: Heat Transfer Analysismentioning

confidence: 99%

Study of Extrude Aluminum Alloy LED Bulb in a Passive Mode of Cooling System with a Different Array of Fin Structure

Namdeo Pawar,

Nanwala

2024

J. Mater. Eng.

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“…With the prosperity of 5G, arti cial intelligence, the Internet of Things, and smart cities, along with the extensive application of big data and cloud computing, continuous miniaturization and performance improvement have led to an exponential increase in power consumption and heat generation within the system. The increasing demand for heat dissipation poses more severe challenges to the structural design ( Shape optimization (Gkaragkounis et al, 2018;Zhou & Rozvany, 2015), parameter optimization (Diligenskaya, 2018;José S. Moita et al, 2018;Michalewicz, 1996), and topology optimization(Hao Li, 2019; Meng et al, 2021;Mo et al, 2021) are commonly used optimization methods for heat sinks.…”

Section: Introductionmentioning

confidence: 99%

Topology optimization of heat sinks in half-open space: a study on design domain

Yu,

Liu,

2024

Preprint

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Efficient heat sinks are the key components of heat dissipation devices. Although topology optimization can theoretically design high-performance heat sinks, screening a design domain in an open space is still a challenge. This work studies the topology optimization of three-dimensional (3D) heat sinks for LED chips using the variable density method, without considering air convection to save computing resources. A theoretical analysis proposes that the design domain should be approximately a hemisphere. Topology optimization is performed in three shaped design domains, namely cylindrical, conical frustum, and inverted conical frustum. By 3D printing three topology-optimized heat sinks, their actual heat dissipation effects on LED chips are compared. The experiment and simulation results consistently show that the heat sink in the conical frustum design domain has the best heat dissipation effect. Equipped with such a heat sink, a 5-W LED chip is 5.1°C cooler than that with the traditional finned heat sink. Our results show that a well-selected design domain can effectively balance the heat conduction and heat exchange, eventually leading to a better heat sink.

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Optimization of the Overall Heat Transfer Coefficient of the Frozen Seal Valve Fin Tube Assembly for Fast Reactors

Kudiyarasan,

Biswas

2024

Materials and Manufacturing

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<div>Sodium is used as a coolant in the fast reactor’s primary and secondary loops to transfer enthalpy from the reactor and transport it to the expander. However, handling sodium is difficult, and it can be hazardous if it comes into contact with air, which causes an exothermic reaction. During maintenance of sodium loop components, isolation is typically accomplished with valves. The valve leaking is caused by the seal or the gland. Seal leakage is compensated because it occurs within the line, but gland leakage should be zero because the liquid is harmful. To address this requirement, the author attempted to design a special type of valve in which sodium is allowed to rise through an annular path along the stem and heat transfer is augmented in such a way that the required enthalpy is evacuated to freeze sodium inside the annular path, confirming the fail-safe zero gland leakage. A finned tube assembly is fitted around the stem to achieve this concept of expanded surface heat transfer. However, the issue is to design the fin tube assembly, as well as the number of fins and their dimensions. Normally, these things are done through a series of physical model studies, which is inefficient. In our study, we used conjugate heat transfer analysis to design the fin tube assembly, which was then tested using a physical model.</div>

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Method of Parametric Optimization in Problems of Identification of Boundary Conditions of Convective Heat Transfer in Processes of Non-Stationary Heat Conduction

Cited by 3 publications

References 10 publications

Study of Extrude Aluminum Alloy LED Bulb in a Passive Mode of Cooling System with a Different Array of Fin Structure

Study of Extrude Aluminum Alloy LED Bulb in a Passive Mode of Cooling System with a Different Array of Fin Structure

Topology optimization of heat sinks in half-open space: a study on design domain

Optimization of the Overall Heat Transfer Coefficient of the Frozen Seal Valve Fin Tube Assembly for Fast Reactors

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