Methodical Support for the New Development of Cyber-Physical Product Families

Küchenhof, Jan; Berschik, M. C.; Heyden, Emil; Krause, Dieter

doi:10.1017/pds.2022.51

Cited by 6 publications

(9 citation statements)

References 19 publications

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“…Within this paper, the development of complex systems is equated with the development of mechatronic systems, as these require an increased interaction of different development disciplines, such as mechanics, electronics, and software. Other complex systems would also be the development of cyber-physical systems and the development of cybertronic elements (Küchenhof et al, 2022). In developing mechatronic systems, the V-model is often used as a framework for development, considered an example in this paper.…”

Section: Development Of Mechatronic Systemsmentioning

confidence: 99%

“…These requirements are broken down via the V-model into functions, logic, and discipline-specific designs with disciplinespecific components to more effectively implement the requirements (Graessler et al, 2018). The discipline-specific design phases form the basis for the architecture of the resulting system and thus also influence the development of a modular product family (Küchenhof Berschik 2022).…”

Section: Development Of Mechatronic Systemsmentioning

confidence: 99%

“…Figure 1. Multi-and cross-disciplinary design with the V-Model integrated into the life-phases of a product adapted from (Eigner et al, 2014;Küchenhof et al, 2022;Zuefle et al, 2021).…”

Section: Development Of Mechatronic Systemsmentioning

confidence: 99%

“…Accordingly, it must be analyzed to what extent the changes in the product architecture due to both increasing digital shares and the need for interactions can be transferred to the organizational structure, respectively to what time the transparency in the new product architecture can be mapped to such an extent that conclusions can be drawn about the organizational structure. For handling complex products and systems, the development of modular product families has become generally accepted (Krause et al, 2014;Küchenhof et al, 2022). The development of modular product families must be adapted to a discipline-spreading beginning to cover all interests of the involved development disciplines.…”

Section: Motivation and Introductionmentioning

confidence: 99%

“…The development of modular product families must be adapted to a discipline-spreading beginning to cover all interests of the involved development disciplines. A crossdisciplinary approach can help to provide a more transparent view of the interplay and interaction of different stakeholders in the development of a complex system, allowing conclusions to be drawn about the development of the organizational structure for future PFGs (Küchenhof et al, 2022).…”

Section: Motivation and Introductionmentioning

confidence: 99%

See 4 more Smart Citations

Assessing the Influence of Digital Innovations on the Organizational Design of Product Family Generations

Zuefle¹,

Küchenhof²,

Hanna³

et al. 2022

DS 121: Proceedings of the 24th International DSM Conference (DSM 2022), Eindhoven, the Netherlands, October, 11 - 13, 2022

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The paper discusses increasing demands on product architecture and the resulting requirements and implications for organizational structure. Due to the rising conditions, the product architecture is increasingly developing into a complex construct in which transparency must be increased to continue developing products effectively. The approach of this paper is, based on the method of Design for Variety, a matrix-based modularization with the DSM and its extension to a cross-discipline multi-domain matrix to establish a reference to the organizational structure and to align it in a value-added way to good product architecture. This is done by an exemplary Investigation of the product family generation of a vacuum robot.

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Section: Development Of Mechatronic Systemsmentioning

confidence: 99%

Section: Development Of Mechatronic Systemsmentioning

confidence: 99%

“…Figure 1. Multi-and cross-disciplinary design with the V-Model integrated into the life-phases of a product adapted from (Eigner et al, 2014;Küchenhof et al, 2022;Zuefle et al, 2021).…”

Section: Development Of Mechatronic Systemsmentioning

confidence: 99%

Section: Motivation and Introductionmentioning

confidence: 99%

Section: Motivation and Introductionmentioning

confidence: 99%

See 3 more Smart Citations

Assessing the Influence of Digital Innovations on the Organizational Design of Product Family Generations

Zuefle¹,

Küchenhof²,

Hanna³

et al. 2022

DS 121: Proceedings of the 24th International DSM Conference (DSM 2022), Eindhoven, the Netherlands, October, 11 - 13, 2022

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A Review on Sensor‐Integrating Machine Elements

Kirchner,

Wallmersperger,

Gwosch

et al. 2024

Advanced Sensor Research

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This contribution summarizes the current state of research regarding so‐called sensor‐integrating machine elements as an enabler of digitalization in mechanical engineering and——if available—their application in industry. The focus is on the methodical aspects of the development of these machine elements in general as well as specific sensor‐integrating machine elements that are either already in use or currently under development. Developmental aspects include the robust design of initially evaluated concepts for sensor‐integrating machine elements as well as their modularization. Smart materials with sensory functions are included in the analysis as well as the differentiation with regard to add‐on sensors. The aim of the authors interlinked by a special research program funded by the German Research Foundation (DFG) is to facilitate the exchange with other researchers with the help of the comprehensive overview given in this contribution. The contribution concludes with a brief discussion of open challenges, such as the energy supply and data transfer in rotating systems and also data security.

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Development of a model-based modular building kit for sensor-integrating machine elements—Theory and application

Küchenhof,

Breimann,

Kirchner

et al. 2024

Forsch Ingenieurwes

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In the Priority Program 2305 of the German Research Foundation, so-called Sensor-integrating Machine Elements (SiME) are to be developed. These are essentially highly standardized components with integrated microelectronics. The present article presents the development of a model-based construction kit to support the design of integrated sensor systems for these new machine elements. A methodical procedure for collecting the development data required for modeling the modular building kit for SiME is presented and applied to four different cases within the project. Use cases, product structure and module diagrams were recorded and modeled for the machine elements screw, gear, coupling and feather key. These are then linked in SysML models to enable sensor systems for SiME to be configured in line with requirements. The modeling of the system architectures deepens the understanding of the underlying mechatronic system architecture and supports the identification of differentiation features as well as synergy potentials.

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Methodical Support for the New Development of Cyber-Physical Product Families

Cited by 6 publications

References 19 publications

Assessing the Influence of Digital Innovations on the Organizational Design of Product Family Generations

Assessing the Influence of Digital Innovations on the Organizational Design of Product Family Generations

A Review on Sensor‐Integrating Machine Elements

Development of a model-based modular building kit for sensor-integrating machine elements—Theory and application

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