Methodology and apparatus for rapid power cycle accumulation and in-situ incipient failure monitoring for power electronic modules

Davis, R.I.; Sprenger, Daniel J.

doi:10.1109/ectc.2014.6897576

Cited by 16 publications

(2 citation statements)

References 3 publications

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“…In [60]- [62], the PC test is performed under converter operation with real inductive loads or motors. However, the PC test with real loads is not cost-effective because real loads consume large power during a long test period.…”

Section: B Ac Power Cycling Test Circuit Close To Real Convertermentioning

confidence: 99%

Power Cycling Test Methods for Reliability Assessment of Power Device Modules in Respect to Temperature Stress

Choi

Blaabjerg

Jørgensen

2018

IEEE Trans. Power Electron.

187

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Power cycling test is one of the important tasks to investigate the reliability performance of power device modules in respect to temperature stress. From this, it is able to predict the lifetime of a component in power converters. In this paper, representative power cycling test circuits, measurement circuits of wear-out failure indicators as well as measurement strategies for different power cycling test circuits are discussed in order to provide the current state of knowledge of this topic by organizing and evaluating current literature. In the first section of this paper, the structure of a conventional power device module and its related wear-out failure mechanisms with degradation indicators are discussed. Then, representative power cycling test circuits are introduced. Furthermore, on-state collector-emitter voltage (V C E O N ) and forward voltage (V F ) measurement circuits for wear-out condition monitoring of power device modules during power cycling test are presented. Finally, different junction temperature measurement strategies for monitoring of solder joint degradation are explained.Index Terms-Failure mechanism, insulated gate bipolar transistor (IGBT), power cycling (PC) test, power device module, reliability, wear-out failure.

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Section: B Ac Power Cycling Test Circuit Close To Real Convertermentioning

confidence: 99%

Power Cycling Test Methods for Reliability Assessment of Power Device Modules in Respect to Temperature Stress

Choi

Blaabjerg

Jørgensen

2018

IEEE Trans. Power Electron.

187

View full text Add to dashboard Cite

show abstract

“…The ageing failure of IGBT modules are due to long-term work in harsh environment which leading to bear the continuous impact of thermal mechanical stress. Finally, due to the thermal fatigue cumulative damage, the working performance of the module will degrade leading the module parameters or signal shift [16]- [17]. This failure mode is slow and inevitable, if not found in time, will eventually evolve into a catastrophic failure, especially for some high reliability applications will cause incalculable significant losses.…”

Section: A General Idea Of Condition Monitoring Methodsmentioning

confidence: 99%