“…This method has been developed into two kinds of techniques, with 4–10 or without an interlayer 11,12 . Comparing with the latter, an interlayer can firstly melt and then provide a transient liquid phase 7,8,13 or a partial transient liquid phase 5,6,9,10 to assist the spreading and wetting of initial substances, and hence can diminish the temperature, pressure and duration of joining, 14 prevent plastic deformation, relieve residual stresses, and decrease inhomogeneity in the bonding layer 2 . Many metallic interlayer systems such as Cu/Nb/Cu, 10,15 Ni/Nb/Ni, 16,17 Nb/V, 18 Cu, 19,20 Cu/Nb, 21 Cu/Pt/Cu, 5 Cu/Ni/Cu, 6 Cu/Cu 2 O, 22 Cu/Ag, 23 Cu/Al, 24 and Cu/Ti 24 have been invented to join sapphire crystal or alumina.…”