Methods of Printing Copper for PCB Repair

Richmond, Dylan; Enakerakpo, Emuobosan; Alhendi, Mohammed; McClure, Peter; Poliks, Mark D.

doi:10.1109/ectc51906.2022.00363

Cited by 2 publications

(1 citation statement)

References 16 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Recently, printed W has been used as solar absorber coatings [ 159 ] and radiation shielding on circuit boards ( Figure 3 a) [ 160 ]. In contrast, printed Cu has been utilized in various applications such as Cu grid electrodes for organic light-emitting diodes (OLEDs) ( Figure 3 b) [ 161 ], porous 3D scaffold for Li-ion batteries [ 56 ], current collecting grids for photovoltaics [ 162 ], repairing PCB boards [ 163 ], interconnects and power electronics [ 164 , 165 , 166 ], resistive temperature sensors [ 167 ]. The following section discusses the progress and challenges of printing Cu and W for these applications.…”

Section: Cu and W Printingmentioning

confidence: 99%

A Review on Progress, Challenges, and Prospects of Material Jetting of Copper and Tungsten

Doddapaneni,

Lee,

Aysal

et al. 2023

Nanomaterials

View full text Add to dashboard Cite

Copper (Cu) and tungsten (W) possess exceptional electrical and thermal conductivity properties, making them suitable candidates for applications such as interconnects and thermal conductivity enhancements. Solution-based additive manufacturing (SBAM) offers unique advantages, including patterning capabilities, cost-effectiveness, and scalability among the various methods for manufacturing Cu and W-based films and structures. In particular, SBAM material jetting techniques, such as inkjet printing (IJP), direct ink writing (DIW), and aerosol jet printing (AJP), present a promising approach for design freedom, low material wastes, and versatility as either stand-alone printers or integrated with powder bed-based metal additive manufacturing (MAM). Thus, this review summarizes recent advancements in solution-processed Cu and W, focusing on IJP, DIW, and AJP techniques. The discussion encompasses general aspects, current status, challenges, and recent research highlights. Furthermore, this paper addresses integrating material jetting techniques with powder bed-based MAM to fabricate functional alloys and multi-material structures. Finally, the factors influencing large-scale fabrication and potential prospects in this area are explored.

show abstract

Section: Cu and W Printingmentioning

confidence: 99%

A Review on Progress, Challenges, and Prospects of Material Jetting of Copper and Tungsten

Doddapaneni,

Lee,

Aysal

et al. 2023

Nanomaterials

View full text Add to dashboard Cite

show abstract

Rapid PCB Development Using CO₂ Laser and Galvo Scanner for Modular Battery Management Systems

Sharma,

Samanta,

Huynh

et al. 2023

IECON 2023- 49th Annual Conference of the IEEE Industrial Electronics Society

View full text Add to dashboard Cite

Methods of Printing Copper for PCB Repair

Cited by 2 publications

References 16 publications

A Review on Progress, Challenges, and Prospects of Material Jetting of Copper and Tungsten

A Review on Progress, Challenges, and Prospects of Material Jetting of Copper and Tungsten

Rapid PCB Development Using CO₂ Laser and Galvo Scanner for Modular Battery Management Systems

Contact Info

Product

Resources

About

Methods of Printing Copper for PCB Repair

Cited by 2 publications

References 16 publications

A Review on Progress, Challenges, and Prospects of Material Jetting of Copper and Tungsten

A Review on Progress, Challenges, and Prospects of Material Jetting of Copper and Tungsten

Rapid PCB Development Using CO2 Laser and Galvo Scanner for Modular Battery Management Systems

Contact Info

Product

Resources

About

Rapid PCB Development Using CO₂ Laser and Galvo Scanner for Modular Battery Management Systems