2011
DOI: 10.1108/02602281111110013
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Micro crack detection of multi‐crystalline silicon solar wafer using machine vision techniques

Abstract: Purpose -The detection of invisible micro cracks (m-cracks) in multi-crystalline silicon (mc-si) solar wafers is difficult because of the wafers' heterogeneously textured backgrounds. The difficulty is twofold. First, invisible m-cracks must be visualized to imaging devices. Second, an image processing sequence capable of extracting m-cracks from the captured images must be developed. The purpose of this paper is to reveal invisible m-cracks that lie beneath the surface of mc-si solar wafers. Design/methodolog… Show more

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Cited by 70 publications
(41 citation statements)
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“…In this paper, we have classified cracks as either macro-or microcracks (μ-cracks) according to the crack width sizes. The crack with size smaller than 30 μm in width is usually referred to as a μ-crack [39]. The cracks are further classified according to their position as either facial or subfacial cracks.…”
Section: Classifications Of Microcracksmentioning
confidence: 99%
See 1 more Smart Citation
“…In this paper, we have classified cracks as either macro-or microcracks (μ-cracks) according to the crack width sizes. The crack with size smaller than 30 μm in width is usually referred to as a μ-crack [39]. The cracks are further classified according to their position as either facial or subfacial cracks.…”
Section: Classifications Of Microcracksmentioning
confidence: 99%
“…They did not report the minimum microcrack size that can be detected using this approach. The PL imaging system proposed by Yih-Chih et al [39] has been used to detect invisible subfacial microcracks down to 13.4 μm. Image processing was used to extract the microcracks.…”
Section: Electroluminescence Imaging and Photoluminescence Imagingmentioning
confidence: 99%
“…It can detect only the specific saw-mark defects. Chiou and Liu [16] used a near infrared imaging system to highlight micro-cracks in solar wafers. The method works only when the sensed microcrack is significantly darker than the crystal grains.…”
Section: Introductionmentioning
confidence: 99%
“…A great deal of effort has been directed to this end, where a variety of techniques including resonance ultrasonic vibration analysis [7], electroluminescence [8], and photoluminescence imaging [9] have been developed and demonstrated. The use of nIR backlighting and front side imaging has also been suggested as a viable screening method [10]. Furthermore, several infrared thermography-based approaches have been proposed: radiometric pulse and thermal imaging under various cell voltage and light bias conditions [11], lock-in thermography incorporating temperature cycling and voltage biasing [12], and a thermography technique aimed to assess edge leakage currents from periodic surface temperature oscillations following laser scribing and cleavage [13].…”
Section: Introductionmentioning
confidence: 99%