Micro-Jet Printing of Polymers and Solder for Electronics Manufacturing

Hayes, Donald J.; Cox, W. Royall; Grove, Michael E.

doi:10.1142/s0960313198000197

Cited by 50 publications

(17 citation statements)

References 0 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The impingement process should dissipate any excess energy of the droplet upon impact and reach an energetically stable state with both the substrate and any other droplets previous deposited within the locale. The phase change typically takes the form of evaporation of carrier solvent [38-40, 44, 54, 60, 67], although can also be via solidification [47,51,56], or gelation [68,69]. Depending upon the ink system used, it may subsequently be necessary to perform further processing to achieve the desired functionality, such as thermal treatment [44,[70][71][72], electromagnetic irradiation [73][74][75], or chemical treatment [76][77][78][79][80][81].…”

Section: Droplet Behaviour On a Substratementioning

confidence: 99%

“…These two mechanisms in which surface tension are involved, however, are contradictory, demonstrating the complex relationship that surface tension has on the printability of an ink. In practice, fluids have been successfully printed over a wide range of surface tensions; from organic solvent-based inks with low surface tension (~20 mJ m À2 ) [44] to high surface tension liquid metals (~500 mJ m À2 ) [51]. Numerical modelling [52] has demonstrated the interplay between the fluid properties on the printing process by means of the Ohnesorge number (Oh ¼ g ffiffiffiffiffiffiffiffiffiffiffi qD 0 r p , where g is the fluid viscosity, q is fluid density, D 0 is the nozzle diameter and r is the fluid surface tension).…”

mentioning

confidence: 99%

See 1 more Smart Citation

Integration of additive manufacturing and inkjet printed electronics: a potential route to parts with embedded multifunctionality

et al. 2016

View full text Add to dashboard Cite

-Additive manufacturing, an umbrella term for a number of different manufacturing techniques, has attracted increasing interest recently for a number of reasons, such as the facile customisation of parts, reduced time to manufacture from initial design, and possibilities in distributed manufacturing and structural electronics. Inkjet printing is an additive manufacturing technique that is readily integrated with other manufacturing processes, eminently scalable and used extensively in printed electronics. It therefore presents itself as a good candidate for integration with other additive manufacturing techniques to enable the creation of parts with embedded electronics in a timely and cost effective manner. This review introduces some of the fundamental principles of inkjet printing; such as droplet generation, deposition, phase change and post-deposition processing. Particular focus is given to materials most relevant to incorporating structural electronics and how post-processing of these materials has been able to maintain compatibility with temperature sensitive substrates. Specific obstacles likely to be encountered in such an integration and potential strategies to address them will also be discussed.

show abstract

Section: Droplet Behaviour On a Substratementioning

confidence: 99%

mentioning

confidence: 99%

Integration of additive manufacturing and inkjet printed electronics: a potential route to parts with embedded multifunctionality

et al. 2016

View full text Add to dashboard Cite

show abstract

“…Aside from applications related to rapid prototyping 37 different ink systems mainly developed for electronic applications have been reported. The systems range from thermal 38 , and photo 39 curable sol gel glasses over epoxy systems 40 to photoresist systems and polymers. One of the major challenges to overcome when printing this material class is nozzle clogging due to the high evaporation rates of the used solvents.…”

Section: Inkjet Printed Non-volatile Memory Elementsmentioning

confidence: 99%

Inkjet-printing of non-volatile organic resistive devices and crossbar array structures

et al. 2015

View full text Add to dashboard Cite

Due to the increasing demand for storage capacity in various electronic gadgets like mobile phones or tablets, new types of non-volatile memory devices have gained a lot of attention over the last few years. Especially multilevel conductance switching elements based on organic semiconductors are of great interest due to their relatively simple device architecture and their small feature size. Since organic semiconductors combine the electronic properties of inorganic materials with the mechanical characteristics of polymers, this class of materials is suitable for solution based large area device preparation techniques. Consequently, inkjet based deposition techniques are highly capable of facing preparation related challenges. By gradually replacing the evaporated electrodes with inkjet printed silver, the preparation related influence onto device performance parameters such as the ON/OFF ratio was investigated with IV measurements and high resolution transmission electron microscopy. Due to the electrode surface roughness the solvent load during the printing of the top electrode as well as organic layer inhomogeneity's the utilization in array applications is hampered. As a prototypical example a 1diode-1resistor element and a 2x2 subarray from 5x5 array matrix were fully characterized demonstrating the versatility of inkjet printing for device preparation.

show abstract

“…A freeform fabrication method developed by Malone et al (2004) and Malone and Lipson (2006) uses two separate deposition tools for fabrication of 3D functional assemblies with embedded conductive wiring, power sources and actuators. Other examples of simultaneously using multiple deposition tools are: Hayes et al (1998) investigated a micro-jet printing process for polymer and solder deposition for chip-scale packaging (CSP) in microelectronics manufacturing; Fuller et al (2002) employed multiple ink-jet deposition heads mounted on a computer-controlled 3-axis gantry to continuously squeeze nano-particles to additively build micro electromechanical systems and electrical circuitry.…”

Section: Deposition Of Melted Materialsmentioning

confidence: 99%

A review of hybrid manufacturing processes – state of the art and future perspectives

Zhu

Dhokia

Nassehi

et al. 2013

International Journal of Computer Integrated Manufacturing

253

View full text Add to dashboard Cite

Today, hybrid manufacturing technology has drawn significant interests from both academia and industry due to the capability to make products in a more efficient and productive way. Although there is no specific consensus on the definition of the term 'hybrid processes', researchers have explored a number of approaches to combine different manufacturing processes with the similar objectives of improving surface integrity, increasing material removal rate, reducing tool wear, reducing production time and extending application areas. Thus, hybrid processes open up new opportunities and applications for manufacturing various components which are not able to be produced economically by processes on their own. This review paper starts with the classification of current manufacturing processes based on processes being defined as additive, subtractive, transformative, joining and dividing. Definitions of hybrid processes from other researchers in the literature are then introduced. The major part of this paper reviews existing hybrid processes reported over the past two decades. Finally, this paper attempts to propose possible definitions of hybrid processes along with the authors' classification, followed by discussion of their developments, limitations and future research needs.

show abstract

Micro-Jet Printing of Polymers and Solder for Electronics Manufacturing

Cited by 50 publications

References 0 publications

Integration of additive manufacturing and inkjet printed electronics: a potential route to parts with embedded multifunctionality

Integration of additive manufacturing and inkjet printed electronics: a potential route to parts with embedded multifunctionality

Inkjet-printing of non-volatile organic resistive devices and crossbar array structures

A review of hybrid manufacturing processes – state of the art and future perspectives

Contact Info

Product

Resources

About