Micro-machining of silicon wafer in air and under water

Wee, Lee Mein; Ng, Eric; Prathama, Aditya Heru; Zheng, Hui

doi:10.1016/j.optlastec.2010.05.005

Cited by 73 publications

(40 citation statements)

References 24 publications

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“…Laser is widely used in many applications, such as material processing, laser cutting, drilling, and welding. Laser has advantages over other methods of material processing due to its reduced heat-affected zone (HAZ), higher speed, versatility, and environmental friendly in nature [8]. Laser processing is a noncontacting and abrasionless technique, which eliminates cutting forces and metal fracture.…”

Section: Introductionmentioning

confidence: 99%

“…Laser processing is a noncontacting and abrasionless technique, which eliminates cutting forces and metal fracture. It also reduces limitations in shape formation with minimal surface damage and maximum processing efficiency [8,9]. The use of lasers in material drilling is gaining wide acceptance, especially in the thin sheet metal industry, because of its low operational cost and the high precision conferred by certain inherent properties of laser beams [10].…”

Section: Introductionmentioning

confidence: 99%

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Comparison of the simulation and experimental of hole characteristics during nanosecond-pulsed laser drilling of thin titanium sheets

Ren

Jiang

Liú

et al. 2014

Int J Adv Manuf Technol

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This paper reports theoretical and experimental results of drilling titanium sheets with a thickness of 0.2 mm using a nanosecond-pulsed laser. To describe morphological changes and the temperature distribution during nanosecond laser drilling, a physical model was established using ANSYS parametric design language (APDL) with life and death technology of ANSYS software. The influences of laser parameters such as laser energy and pulse number on the dimensions (depth and diameter) of the drilled holes were investigated with optical microscope. The crater depth and diameter could be increased by increasing the number of laser pulses and laser energy with some defects. Compared with experimental results, numerical results show slight difference, which is in the acceptable range.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Comparison of the simulation and experimental of hole characteristics during nanosecond-pulsed laser drilling of thin titanium sheets

Ren

Jiang

Liú

et al. 2014

Int J Adv Manuf Technol

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“…This phenomenon occurs by the high material removal that resulted in the faster rate of vapor pressure buildup inside the drilling hole in the higher laser power condition. The increasing material removal of silicon wafer caused the larger drilling holes produced by decreasing the pulse frequency (Wee et al 2011).…”

Section: Resultsmentioning

confidence: 99%

“…Spatter deposition and hole diameter increase with increasing laser peak power and duty cycle. Wee et al (2011) discussed four controlled parameters that affected the laser processing of silicon wafer in air and under water. The controlled parameters consist of scan velocity, laser pulse frequency, power level, and focal plane position that affect the laser spatter deposition (in air), irradiated areas (under water), and taper formation.…”

Section: Introductionmentioning

confidence: 99%

Micro-drilling of silicon wafer by industrial CO2 laser

Sivarao

Kasim

Ali

et al. 2015

Int J Mech Mater Eng

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Background: Laser micromachining is currently used in the MEMS production to replace the traditional etching process which consumes longer time to complete. The objective of this study is to investigate the drilling capability of industrial CO 2 laser in processing of silicon wafer. Methods: In this work, the holes were drilled on P-type silicon wafer with thickness of 525 μm. Geometrical characteristic of holes produce, which is diameter entrance that depends on laser parameter were investigated and analyzed. Analysis of Variance (ANOVA) was used to analyze the result and generated an appropriate model for the laser drilling processing. Results: The laser parameters involved were laser power, pulse frequency and duty cycle. The experimental results showed the entrance diameter of drilling holes was increase when the laser power and duty cycle increased. Conclusion: The entrance diameter of drilling hole decreases when the pulse frequency increases.

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“…Thus, laser drilling has been considered as alternative non-contact via-hole fabrication method. Previous studies demonstrated the via hole drilling processes based on nanosecond [8][9][10], picosecond [11], and femtosecond [12][13][14][15][16][17][18] lasers. However, systematic studies on mc-Si drilling by ultrafast lasers are rare.…”

Section: Introductionmentioning

confidence: 99%

Femtosecond laser drilling of crystalline and multicrystalline silicon for advanced solar cell fabrication

et al. 2012

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The rear contact solar cell concept has been implemented to increase the solar cell efficiency. Practically, it necessitates rapid fabrication of a large number of via holes to form low-loss current paths. It is not a trivial task to drill a number of microscopic holes through a typical Si wafer of ∼200 µm thickness at reasonable processing throughput and yield. In this research, a femtosecond laser is employed to drill via holes in both crystalline silicon (c-Si) and multicrystalline silicon (mc-Si) thin wafers of ∼170 µm thickness with various laser parameters such as number of laser shots and pulse energy. Since a significantly high pulse energy compared to ablation threshold is mainly applied, aiming to achieve a rapid drilling process, the femtosecond laser beam is subjected to complex non-linear characteristics. Therefore, the relative placement of the sample with respect to the laser focal position is also rigorously examined. While the non-linear effect at high pulse energy regime is complex, it also facilitates the drilling process in terms of achieving high-aspect ratio, for example, by extending the effective depth of focus by non-linear effect. Cross-sectional morphological analysis in conjunction with on-line emission and shadowgraph imaging are carried out in order to elucidate the drilling mechanism.

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Micro-machining of silicon wafer in air and under water

Cited by 73 publications

References 24 publications

Comparison of the simulation and experimental of hole characteristics during nanosecond-pulsed laser drilling of thin titanium sheets

Comparison of the simulation and experimental of hole characteristics during nanosecond-pulsed laser drilling of thin titanium sheets

Micro-drilling of silicon wafer by industrial CO2 laser

Femtosecond laser drilling of crystalline and multicrystalline silicon for advanced solar cell fabrication

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