Micro-Raman investigation of stress distribution in laser drilled via structures

Wasyluk, Joanna; Adley, David; Perova, Tatiana S.; Rodin, Aleksej M.; Callaghan, J. J.; Brennan, Noel A.

doi:10.1016/j.apsusc.2008.09.004

Cited by 10 publications

(8 citation statements)

References 4 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…With the development of the Raman spectroscopy, in particular, since the spatial resolution of Raman spectroscopy is less than 1 μm (micro-Raman spectroscopy, μ-Raman), Raman spectroscopy has become an important tool for studying local stress and it has been applied more and more in detecting and calculating quantitatively residual stress on the basis of the band position shift of Raman spectra [ 97 , 98 , 99 ]. For example, in order to compare the residual stress induced by micro-machining of single crystal Si using femtosecond and nanosecond lasers, micro-Raman spectroscopy detection was performed by Amer et al [ 98 ].…”

Section: Raman Spectroscopy Characterization In Micro/nano-machinimentioning

confidence: 99%

“…Also, the residual stress decreased with the increase in the cutting depth. The residual stress induced by nanosecond laser drilling of Si was calculated using Equation (9), and the unstressed position of Si was 520 cm −1 [ 99 ]. The results revealed that residual stress depended on the diameter and polarization of the laser beam.…”

Section: Raman Spectroscopy Characterization In Micro/nano-machinimentioning

confidence: 99%

See 1 more Smart Citation

Topic Review: Application of Raman Spectroscopy Characterization in Micro/Nano-Machining

Song

et al. 2018

Micromachines

132

View full text Add to dashboard Cite

The defects and subsurface damages induced by crystal growth and micro/nano-machining have a significant impact on the functional performance of machined products. Raman spectroscopy is an efficient, powerful, and non-destructive testing method to characterize these defects and subsurface damages. This paper aims to review the fundamentals and applications of Raman spectroscopy on the characterization of defects and subsurface damages in micro/nano-machining. Firstly, the principle and several critical parameters (such as penetration depth, laser spot size, and so on) involved in the Raman characterization are introduced. Then, the mechanism of Raman spectroscopy for detection of defects and subsurface damages is discussed. The Raman spectroscopy characterization of semiconductor materials’ stacking faults, phase transformation, and residual stress in micro/nano-machining is discussed in detail. Identification and characterization of phase transformation and stacking faults for Si and SiC is feasible using the information of new Raman bands. Based on the Raman band position shift and Raman intensity ratio, Raman spectroscopy can be used to quantitatively calculate the residual stress and the thickness of the subsurface damage layer of semiconductor materials. The Tip-Enhanced Raman Spectroscopy (TERS) technique is helpful to dramatically enhance the Raman scattering signal at weak damages and it is considered as a promising research field.

show abstract

Section: Raman Spectroscopy Characterization In Micro/nano-machinimentioning

confidence: 99%

Section: Raman Spectroscopy Characterization In Micro/nano-machinimentioning

confidence: 99%

Topic Review: Application of Raman Spectroscopy Characterization in Micro/Nano-Machining

Song

et al. 2018

Micromachines

132

View full text Add to dashboard Cite

show abstract

“…Wasyluk et al [20] employed Micro-Raman spectroscopy for investigating residual stresses in laser drilling of 675 mm thick single crystal silicon wafers. The authors reported influence of micro-machining parameters such as via diameter, repetition ratio, laser polarisation and method of laser drilling on the induced stresses and structural changes in the HAZ.…”

Section: Introductionmentioning

confidence: 99%

Evaluation of thermal residual stresses in laser drilled alumina ceramics using Micro-Raman spectroscopy and COMSOL Multiphysics

Bharatish¹,

Murthy²,

Aditya³

et al. 2015

Optics & Laser Technology

View full text Add to dashboard Cite

“…The change curve of the yellowness ( B *), haze, and transmittance of the colloidal siloxane layer after curing was investigated using a haze meter (COH 400, Nippon Denshoku Co., Ltd., Japan), as shown in Figure c,d, and e respectively. EB irradiation causes the PET film to undergo thermal aging . The optical performance decreased more significantly with an increase in the EB dosage.…”

Section: Results and Discussionmentioning

confidence: 99%

Enhanced Polymerization and Surface Hardness of Colloidal Siloxane Films via Electron Beam Irradiation

Kim

Na³

et al. 2021

ACS Omega

View full text Add to dashboard Cite

Electron beam (EB) curing is a foldable hard coating process and has attracted significant research attention in the field of flexible electronic devices. In this study, we report a method for enhancing material surface hardness with low-energy EB curing in a short time. The low-energy EB improved the coating hardness of films by inducing cross-linking polymerization of the silicon-containing monomer. The hardness of the cured coating layer was measured as 3 H using a pencil hardness tester, and the transparency of the coating was higher than 90%. Owing to a series of cross-linking reactions between Si–O–C and Si–OH groups under EB curing and the formation of Si–Si bonds, the cured layer exhibited remarkable durability in the 100000-flexible cycle test. Additionally, the natural oxidation of the C–O groups on the surface of the coating formed carboxyl groups that improved the hydrophilic properties of the coating layer. To the best of our knowledge, this is the first study to propose that the hardness of polyethylene terephthalate films can be improved using low-energy EBs to rapidly cure silicon-containing coatings. Our results provide a novel and commercially viable approach for improving the hardness of touch screens and foldable displays.

show abstract

Micro-Raman investigation of stress distribution in laser drilled via structures

Cited by 10 publications

References 4 publications

Topic Review: Application of Raman Spectroscopy Characterization in Micro/Nano-Machining

Topic Review: Application of Raman Spectroscopy Characterization in Micro/Nano-Machining

Evaluation of thermal residual stresses in laser drilled alumina ceramics using Micro-Raman spectroscopy and COMSOL Multiphysics

Enhanced Polymerization and Surface Hardness of Colloidal Siloxane Films via Electron Beam Irradiation

Contact Info

Product

Resources

About