2022
DOI: 10.1080/10426914.2022.2065007
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Micro-removal characteristics of SiCp/Al by ultrasonic vibration-assisted scratch

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Cited by 11 publications
(2 citation statements)
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“…With the application of ultrasonic vibration-assisted processing technology, scholars have shown great interest in studying the material removal mechanism of this processing technology. Ultrasonic vibration-assisted scratching can achieve plastic removal of materials at large cutting depths, and increasing the ultrasonic amplitude can increase the material removal rate [ 29 ]. Furthermore, the scratching load and friction coefficient are relatively small, while the depth and width of the scratches are relatively large [ 30 ].…”
Section: Machining Mechanism Of Sicp/almentioning
confidence: 99%
“…With the application of ultrasonic vibration-assisted processing technology, scholars have shown great interest in studying the material removal mechanism of this processing technology. Ultrasonic vibration-assisted scratching can achieve plastic removal of materials at large cutting depths, and increasing the ultrasonic amplitude can increase the material removal rate [ 29 ]. Furthermore, the scratching load and friction coefficient are relatively small, while the depth and width of the scratches are relatively large [ 30 ].…”
Section: Machining Mechanism Of Sicp/almentioning
confidence: 99%
“…Xiang et al performed scratch experiments with a single diamond particle on materials with volume fractions of 25%, 40%, 55%, and 70%. These experiments showed that the width of the scratch profile increased significantly with an increase in volume fraction [ 28 ]. Therefore, the volume fraction has an important influence on the machining effect.…”
Section: Introductionmentioning
confidence: 99%