Micro-springs for temporary chip connections

Krüger, Christopher; Bartelink, D. J.; Fritz, T. L.; Leuerer, T.; Mokwa, W.; Schnakenberg, Uwe

doi:10.1016/s0924-4247(00)00401-5

Cited by 13 publications

(14 citation statements)

References 3 publications

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“…14-16). An extended elastic region was observed (1.5-2 times higher in comparison to [2]). This might be caused by the smaller and different geometry of the circular beams as compared to the simple straight beams used in [2] and [16].…”

Section: Measurements and Resultsmentioning

confidence: 83%

“…AZ4526 from Microchemicals, Germany, was used as photoresist. Nickel was electroplated in a nickelsulphamate-based electrolyte (MICROFAB NI-110, Enthone GmbH, Germany, current density 1 A/dm 2 , 40 • C) according to [3] and [12]. The necessary plating duration was individually calculated in dependence of the plating area and the layer thickness.…”

Section: B Production Processmentioning

confidence: 99%

“…The necessary plating duration was individually calculated in dependence of the plating area and the layer thickness. After photoresist stripping, a 60-70-µm-thick copper layer serving as a sacrificial layer was electroplated using the CuBath-SC electrolyte (Enthone GmbH, Germany) according to [12] and [19] with current densities between 0.7 and 1.5 A/dm 2 . This resulted in plating rates of 10 µm/h, causing plating times of up to 7 h. The copper layer planarized by grounding and polishing the entire wafer until the supporting columns were visible.…”

Section: B Production Processmentioning

confidence: 99%

“…Defective components can be replaced, and the test can be repeated until the entire system meets its specifications. Then, the dies are attached to the platform permanently; this can be done by gluing or soldering [2].…”

mentioning

confidence: 99%

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Platform for Temporary Testing of Hybrid Microsystems at High Frequencies

Spanier

Krüger

Schnakenberg

et al. 2007

J. Microelectromech. Syst.

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In this paper, a platform based on the composite-IC concept that is optimized for high-frequency (HF) applications will be presented. Surface-micromachined microsprings are used for temporary connection and testing. This provides the system with an individual compensation of different contact heights due to production tolerances. In addition, self-alignment structures have been added to compensate lateral tolerances. The presented self-alignment structures were designed to compensate rising precision requirements in contrary to commonly used placing machines. Key elements of the HF platform are coplanar waveguides and microsprings that are processed using microelectromechanical-system technologies on alumina ceramic. Microsprings with outer dimensions between 2000 and 125 µm with different beamwidths, beam thicknesses, and beam lengths were designed, simulated, and fabricated. All structures were tested mechanically and electrically. As a further development, spiral microsprings are presented. These combine minimal space requirement with no preferred orientation. Positioning in an individual array is possible. Due to the design and the integration of the spiral microsprings as part of the flip-chip connection, the scattering parameters show excellent HF performance up to frequencies of 9 GHz. The same microsprings could also be used for onboard testing on multichip modules (MCMs). This provides the MCM with cheap and powerful testability and reworkability. This paper covers the mechanical and electrical design, simulation, optimization, production, and characterization of suitable microsprings.[ 2006-0273]Index Terms-Composite IC, high-frequency (HF), known good die (KGD), microsprings, multichip module (MCM).

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Section: Measurements and Resultsmentioning

confidence: 83%

Section: B Production Processmentioning

confidence: 99%

Section: B Production Processmentioning

confidence: 99%

mentioning

confidence: 99%

See 2 more Smart Citations

Platform for Temporary Testing of Hybrid Microsystems at High Frequencies

Spanier

Krüger

Schnakenberg

et al. 2007

J. Microelectromech. Syst.

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“…Then the dies get attached to the platform permanently. This can be done by glueing or soldering (Kru¨ger et al 2000).…”

Section: Introductionmentioning

confidence: 99%

HF-contact elements for testing and multi chip module applications

2006

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In this paper a platform based on the composite IC concept (Semiconductor Industry Association in The NTRS, pp 63, 1994) will be presented that is optimized for high frequency applications. Key elements of the platform are coplanar waveguides and micro springs that are processed using MEMS technologies. Rotation symmetric micro springs with diameters between 500 and 125 lm with different widths and thicknesses were designed, simulated and fabricated. The best mechanical properties were obtained from springs with a diameter of 250 lm. They were made by electroplating of a nickel-tungsten-alloy. FEM simulation of the high frequency performance shows a good performance up to frequencies of 10 GHz.

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Passive Justage zur Prüfung und Kontaktierung von Mikrosystemen

Mokwa

Spanier

VDI-Buch

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Micro-springs for temporary chip connections

Cited by 13 publications

References 3 publications

Platform for Temporary Testing of Hybrid Microsystems at High Frequencies

Platform for Temporary Testing of Hybrid Microsystems at High Frequencies

HF-contact elements for testing and multi chip module applications

Passive Justage zur Prüfung und Kontaktierung von Mikrosystemen

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