Micro-tube insertion into aluminum pads: Simulation and experimental validations

Abstract

Following the trend towards more densely integrated electronic devices; new flip-chip technologies are developed to address very fine pitch interconnection. Among them, it was demonstrated that the hybridization technique based on insertion of gold coated micro-tubes into aluminum pads (Al-0.5Cu) has the capability for a 10µm bonding pitch and the advantage of a room temperature assembly process.In this study, we propose to thoroughly study the electromechanical behavior of the micro-tube inserted into an aluminum pad.