“…Commercial microcantilever arrays [eight beams per chip, CZ growth method, 1,0,0 oriented n ‐doped silicon, resistivity: 1–100 Ω/cm, Octensis, Micromotive GmbH, Mainz, Germany, beam dimension: 500 µm long, 90 µm wide ( s = 0.045 mm 2 ) and 1 µm thick] were asymmetrized prior to coating …”