Microchannel heat sinks with nanofluids for cooling electronic components: Performance enhancement, challenges, and limitations

Maghrabie, Hussein M.; Olabi, Abdul Ghani; Sayed, Enas Taha; Wilberforce, Tabbi; Elsaid, Khaled; Doranehgard, Mohammad Hossein; Abdelkareem, Mohammad Ali

doi:10.1016/j.tsep.2022.101608

Cited by 35 publications

(9 citation statements)

References 246 publications

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“…The addition of solid nanoparticles into the working fluid has been investigated by different researchers as a promising method to enhance heat transfer [58,59]. Also, various studies explored the combination of nanofluids with improvements in geometrical parameters of the heat sink, such as the use of vortex generators [60], ribs and grooves [61,62], pin fins [63], or jet impingement [64].…”

Section: Fluid Additivesmentioning

confidence: 99%

Perspective Chapter: Smart Liquid Cooling Solutions for Advanced Microelectronic Systems

Vilarrubí

2024

Heat Transfer - Advances in Fundamentals and Applications

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Thermal management is today a primary focus in the electronics industry due to the continuous increase of power density in chips increasingly smaller in size, which has become a critical issue in fast-growing industries such as data centers. As air-cooling fails to meet the high heat extraction demands of this sector, liquid cooling emerges as a promising alternative. Nevertheless, advanced microelectronic components require a cooling system that not only reduces the energetic consumption but also enhances the thermal performance by minimizing the thermal resistance and ensuring high-temperature uniformities, especially under variable heat load scenarios with high heat dissipating hotspot regions, where conventional liquid cooling solutions prove inefficient. This chapter provides an overview of different passive heat transfer enhancement techniques of micro heat sinks from the literature, focusing on intelligent and adaptive solutions designed to optimize the cooling performance based on local and instantaneous cooling requirements for non-uniform and time-dependent power distribution maps.

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Section: Fluid Additivesmentioning

confidence: 99%

Perspective Chapter: Smart Liquid Cooling Solutions for Advanced Microelectronic Systems

Vilarrubí

2024

Heat Transfer - Advances in Fundamentals and Applications

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“…Kirsh et al [21,22] showed that DMLS-fabricated wavy microchannels (D h = 620 µm) improved heat transfer by 15%, despite increased pressure drop due to wall roughness (R a ∼ 14 µm). Tiwari et al [23] designed a 3D-printed ABS manifold layer in a copper heat exchanger, enhancing heat transfer coefficient. Gonzalez-Valle et al [24] studied a finned heat exchanger, finding an 11% improvement in overall thermal and hydraulic performance.…”

Section: Introductionmentioning

confidence: 99%

“…In addition, enhancing the specific heat capacity and thermal conductivity of the working fluid through nanoparticles (0.1-100 µm) [22,23] would further improve the thermal efficiency of a MCHS. These liquids are called nanofluids and at high Reynolds number, the presence of nanoparticles creates more contact between the working fluid and the microchannel surfaces, leading to higher heat dissipation.…”

Section: Introductionmentioning

confidence: 99%

Thermal and hydraulic performance of Al alloy-based 3D printed triangular microchannel heatsink governed by rough walls with graphene and alumina nanofluids as working liquid

Nadarajah,

Mohamed,

Abdullah

et al. 2024

J. Micromech. Microeng.

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Microchannel heat sinks (MCHS) are known for providing enhanced cooling performance but their fabrication requires complex and multi step processes. The recent development of additive manufacturing has enabled the fabrication of state-of-art monolithic structures that had been impossible to build using conventional methods. In this work, a monolithic cross-flow triangular cross-section microchannel heat sink was fabricated from aluminum alloy (AlSi10Mg) using the Direct Metal Laser Sintering (DMLS) process. The microchannel wall surface roughness was measured and the cross-section shrinkage of the microchannels was compared with the initial design hydraulic diameter of 500 µm - 1 000 µm., The MCHS with an initial design hydraulic diameter of 750 µm possessed a relative wall surface roughness, Ra of 7.7%. The triangular cross-section hydraulic diameter underwent a shrinkage of 15.2% and 5.3% in terms of the reduction in angle between adjacent side alloys. Experiments were conducted for Reynolds numbers between 50 and 275 with nanofluids containing graphene and Al2O3 nanoparticles in water/water +10% ethylene glycol; these were compared with their respective base fluids. For this range of Reynolds numbers, with water as coolant, the rough wall surface elevated the friction factor to least double that of smooth microchannels. The Poiseuille number indicated that flow was laminar developed with base fluid and laminar developing with nanofluid as coolant. Despite providing the lowest thermal resistance, the graphene nanoparticles in water created the greatest pressure drop leading to a reduced performance coefficient. Al2O3 nanoparticles in water/water +10% Ethylene glycol were found to have 7.7% and 20% better performance coefficients than their respective base fluids.

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“…Particle suspension is a complex fluid that contains a singlephase fluid and suspended particles. It has been extensively applied in natural science and industry fields, such as petroleum extraction [1,2], biomedical engineering [3,4], food processing [5,6], materials science [7,8], and heat transfer systems [9][10][11]. The complex interaction between particles and the base fluid in particle suspension may result in distinct flow and heat transfer characteristics [12].…”

Section: Introductionmentioning

confidence: 99%

Numerical Simulation Study on Heat Transfer Characteristics of Particle‐Loaded Flow in Microchannels

Song,

Guo,

Wang

et al. 2023

Chem Eng & Technol

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Particle suspension is considered powerful and perspective in enhancing heat transfer, but the unclear nature of particle‐loaded flow limits further understanding of particle suspension. Therefore, in this paper, orthogonal experiments and the arbitrary Lagrangian‐Eulerian method were used to investigate the heat transfer characteristics of particle‐loaded flow. Results indicate that when the particle is at the inlet of the microchannel, the factors arranged in important order are the Reynolds number, blockage ratio, particle initial position, specific heat capacity, and thermal conductivity. When the particle is far from the microchannel inlet, the factors arranged in important order are the Reynolds number, blockage ratio, particle initial position, thermal conductivity, and specific heat capacity.

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Microchannel heat sinks with nanofluids for cooling electronic components: Performance enhancement, challenges, and limitations

Cited by 35 publications

References 246 publications

Perspective Chapter: Smart Liquid Cooling Solutions for Advanced Microelectronic Systems

Perspective Chapter: Smart Liquid Cooling Solutions for Advanced Microelectronic Systems

Thermal and hydraulic performance of Al alloy-based 3D printed triangular microchannel heatsink governed by rough walls with graphene and alumina nanofluids as working liquid

Numerical Simulation Study on Heat Transfer Characteristics of Particle‐Loaded Flow in Microchannels

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