Biasing of the specimen is shown to produce improved images in the scanning electron microscope at low beam energies (0.8–2.5 keV) when charging effects (induced by the primary electron beam), topographic effects, or detector shadowing effects would otherwise be present. Examples of such improvement are given for gallium arsenide field‐effect transistors (positive charging), patterned photoresist layers on silicon wafers (negative charging and shadowing in contact holes), fractured polymethylmethacrylate (negative charging), polyethylene wrapper material (positive charging), and polished diamond tools (positive charging). It is concluded that specimen biasing may be a simpler and more convenient way to achieve some of the advantages of the converted backscattered secondary electron (CBSE) technique for imaging, but without some of the fundamental disadvantages of that technique. Characterization of this backscattered electron‐derived image bears further investigation for possible metrological applications.