Microcontact printing of copper and polypyrrole on fluoropolymers

Prissanaroon, W.; Brack, Narelle; Pigram, Paul J.; Hale, Penny S.; Kappen, Peter; Liesegang, J.

doi:10.1016/j.tsf.2004.08.180

Cited by 17 publications

(15 citation statements)

References 38 publications

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“…After modification with copper, the samples were rinsed with de-ionized water, and immediately immersed into a solution containing 0.05 mol/L pyrrole and 0.5 mol/L oxalic acid. The electro polymerization of pyrrole was then performed at a potential of 1.7 V [9] and [10] for a period of 15 min, using a two electrode system separated by a distance of 15 mm. The PPy deposited copper modified aluminium surfaces were rinsed with distilled water followed by rinsing in ethanol and then dried overnight at 70 °C on a hot-plate.…”

Section: Methodsmentioning

confidence: 99%

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Electrochemical synthesis of highly ordered polypyrrole on copper modified aluminium substrates

Ashoka¹,

Noormohammed²,

Sarkar³

2014

Applied Surface Science

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Highlights• Highly ordered polypyrrole has been synthesized on Cu modified Al surface.• A model for ordered polypyrrole growth on Cu modified Al surface has been proposed.• Polypyrrole ordering on Cu(1 0 0) plane is due to the similar inter-monomer distance of PPy with Cu-Cu inter-atomic distance. AbstractFabrication of highly ordered conducting polymers on metal surfaces has received a significant interest owing to their potential applications in organic electronic devices. In this context, we have developed a simple method for the synthesis of highly ordered polypyrrole (PPy) on copper modified aluminium surfaces via electrochemical polymerization process. A series of characteristic peaks of PPy evidenced on the infrared spectra of these surfaces confirm the formation of PPy. The X-ray diffraction (XRD) pattern of PPy deposited on copper modified aluminium surfaces also confirmed the deposition of PPy as a sharp and intense peak at 2θ angle of 23° attributable to PPy is observed while this peak is absent on PPy deposited on as-received aluminiumsurfaces. An atomic model of the interface of PPy/Cu has been presented based on the inter-atomic distance of copper-copper of (1 0 0) plane and the inter-monomer distance of PPy, to describe the ordering of PPy on Cu modified Al surfaces.

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Section: Methodsmentioning

confidence: 99%

“…have been employed as substrates for electrochemical deposition of PPy [3], [4], [5], [6], [7] and [8]. Additionally, copper modified poly(tetrafluoroethylene) films have also been used as substrates for the deposition of PPy [9] and [10]. However, there are no reports so far on the growth of ordered PPy on metal surfaces.…”

Section: Introductionmentioning

confidence: 99%

Electrochemical synthesis of highly ordered polypyrrole on copper modified aluminium substrates

Ashoka¹,

Noormohammed²,

Sarkar³

2014

Applied Surface Science

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“…[33] Recently, polycrystalline [25] On the other hand, Fehling's solution has been frequently used for the electroless plating of copper on surfaces activated by PdCl 2 , which is reduced to Pd metal in the copper-plating bath to act as a catalyst for the subsequent electroless deposition of copper. [34,35] Here, PdCl 2 has been introduced into the reaction mixture of Fehling's solution and the reductant glucose for the catalytic solution synthesis of unique octahedral Cu 2 O nanocages. A typical scanning electron microscopy (SEM) image of the Cu 2 O crystals obtained after 3 h of aging at 75°C is shown in Figure 1a, which suggests that the product exhibits uniform, regular octahedra with an average edge length of ∼ 230 nm.…”

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confidence: 99%

One‐Pot Synthesis of Octahedral Cu₂O Nanocages via a Catalytic Solution Route

et al. 2005

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lithography process, using the increase in the T g of the photoresist particles caused by UV-induced crosslinking. Subsequent deposition of silica through the patterned-colloidal mask yielded ordered domains of nanoscale-hole arrays on a micrometer length scale. The present technique produces a spatially organized mask with multiple length scales for colloidal lithography. As such, various functional materials can be deposited through these multiscale colloidal masks, fabricating nanopatterned substrates, which are of practical significance in a wide range of applications from biosensors to optoelectronic devices. ExperimentalSynthesis of Photoresist Particles: MMA (Aldrich, > 99 %) and GMA (Aldrich, > 95 %) were used as supplied. Potassium persulfate (KPS) was used as an initiator for emulsion polymerization. A 100 mL two-necked round-bottom flask was filled with KPS dissolved in 50 mL of distilled water, and a monomer mixture of MMA and GMA. The content of KPS was fixed at 1 wt.-%. The content of GMA was varied in the range 5-30 wt.-% of the total monomer content, which was fixed at 10 wt.-%. The system was kept under a nitrogen atmosphere and the reaction mixture was stirred magnetically at 300 rpm. When the KPS was dissolved completely, the mixture was heated to 75°C using an oil bath. After 12 h, the mixture was separated by centrifugation and was purified with distilled water several times. The size of the particles, measured by SEM, ranged from 360 to 420 nm. Later, the cationic photoinitiator, Irgacure 250, was introduced to the photoresist particles by spin-coating.Measurement of T g : The glass-transition temperatures of the UV-exposed and UV-screened poly(MMA-co-GMA) particles were determined using a differential scanning calorimeter (DSC, TA Instruments, Q1000) under a nitrogen atmosphere at a heating rate of 10°C min -1 . To measure the T g of UV-exposed particles, the particles were fully baked at 150°C for 2 h after UV exposure, because the crosslinking reaction could proceed during the DSC measurement. Therefore, the measured T g could be higher than the T g of the UV-exposed particles in the patterning. Meanwhile, T g of the UV-screened particles was compared with that estimated using the rule-of-mixtures theory where T g = 115°C for polyMMA and T g = 75°C for polyGMA [19].Deposition of Silica: Silica was deposited in a batch reactor under atmospheric pressure at room temperature. The sample was sequentially exposed to water vapor for 30 min, dried in argon gas for purging the reactor, and then SiCl 4 vapor for 20 min. The reactant vapors were carried by argon gas under atmospheric pressure. The concentration of SiCl 4 was 0.05 vol.-% in moisture-free argon gas and the relative humidity of water vapor was 50 %. (Caution: silicon tetrachloride is a very corrosive liquid. Use it only with adequate ventilation, and wear protective clothing and safety goggles.) The thickness of the silica layer was controlled by the exposure time to the precursor vapor and around 50 nm for 30 min exposure was obtained.

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“…Prior to this step and to the subsequent Cu ELD, the polymer surfaces were chemically oxidized in a H 2 SO 4 =CrO 3 solution and then silanized using, among others, an amino-terminated SAM, namely 3-amino propyltriethoxysilane. Similarly, Prissanaroon et al [12] used mCP to deposit micrometer-scale patterns of Cu on flexible poly(tetrafluoroethylene) (PTFE) films. In that work, the PTFE surface was first Ar plasma pre-treated, then stamped by mCP using a N-[3(trimethoxysilyl)-propyl]diethylenetriamine (TMS) coupling agent, and subsequently activated in an acidic PdCl 2 solution.…”

Section: Selective Metal Pattern Fabrication 693mentioning

confidence: 99%

“…For this purpose, commercial piezoelectric desktop printers controlled by conventional computer software can be used to deliver picoliter volumes of the ''ink'' to be deposited. Both techniques (mCP and IJP) combined with electroless plating have been shown nowadays to be able to provide, under relatively environmentally friendly conditions, high speed patterning over large areas at the surface of various materials, including that of polymer substrates [11][12][13][14][15][16][17][18][19][20][21][22].…”

Section: Introductionmentioning

confidence: 99%

Selective Metal Pattern Fabrication Through Micro-Contact or Ink-Jet Printing and Electroless Plating onto Polymer Surfaces Chemically Modified by Plasma Treatments

Bessueille

Gout

Cotte

et al. 2009

The Journal of Adhesion

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Simple versatile processes combining plasma treatments, micro-contact printing (mCP) or ink-jet printing (IJP), and electroless deposition (ELD) have been developed to produce micrometer and sub-micrometer scale metal (Ni, Ag) patterns at the surface of polymer substrates. Plasma treatments were mainly used to graft the substrate surfaces with either nitrogen-containing functionalities on which a palladium-based catalyst can be subsequently chemisorbed (case of Ni deposition through a tin-free process in solution) or oxygen-containing functionalities on which a tin-based sensitization agent can be subsequently chemisorbed (case of Ag deposition through a redox reaction). mCP of the catalyst or of self-assembled monolayers (SAMs) as well as ink printing were used to obtain locally active or non-active areas at the polymer surfaces. The metal micro-patterns were characterized using optical microscopy, scanning electron microscopy (SEM), and atomic force microscopy (AFM). Surface chemical characterization was carried out by X-ray photoelectron spectroscopy (XPS).

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Microcontact printing of copper and polypyrrole on fluoropolymers

Cited by 17 publications

References 38 publications

Electrochemical synthesis of highly ordered polypyrrole on copper modified aluminium substrates

Electrochemical synthesis of highly ordered polypyrrole on copper modified aluminium substrates

One‐Pot Synthesis of Octahedral Cu₂O Nanocages via a Catalytic Solution Route

Selective Metal Pattern Fabrication Through Micro-Contact or Ink-Jet Printing and Electroless Plating onto Polymer Surfaces Chemically Modified by Plasma Treatments

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Microcontact printing of copper and polypyrrole on fluoropolymers

Cited by 17 publications

References 38 publications

Electrochemical synthesis of highly ordered polypyrrole on copper modified aluminium substrates

Electrochemical synthesis of highly ordered polypyrrole on copper modified aluminium substrates

One‐Pot Synthesis of Octahedral Cu2O Nanocages via a Catalytic Solution Route

Selective Metal Pattern Fabrication Through Micro-Contact or Ink-Jet Printing and Electroless Plating onto Polymer Surfaces Chemically Modified by Plasma Treatments

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One‐Pot Synthesis of Octahedral Cu₂O Nanocages via a Catalytic Solution Route