Microcrack Healing During the Temperature Cycling of Single Phase Ceramics

Case, Eldon D.; Smyth, J. R.; Hunter, O.

doi:10.1007/978-1-4613-3488-0_31

Cited by 20 publications

(6 citation statements)

References 83 publications

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“…Although the grain sizes are not explicitly shown (Figs. 2 and 3), each data point in the two figures corresponds to a specimen of a given grain size having a particular Y and v. For both materials, the highest SThe Young's modulus and Poisson's ratio was, for all of the data, corrected for volume fraction porosity [4]. Most specimens had volume fraction porosities ~< 0.05 [2,6,7,22,24,25,36], so that the magnitude of the porosity correction was not generally large.…”

Section: Microcrack Density As a Function Of Grain Sizementioning

confidence: 99%

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The effect of microcracking upon the Poisson's ratio for brittle materials

Case

1984

J Mater Sci

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Microcracking--elasticity theories typically relate a decrement in elastic moduli to the number density, N, and the mean microcrack radius (a). In this paper, four microcracking-modulus theories are rewritten in terms of the macroscopic, observable parameters of Young's modulus and Poisson's ratio, eliminating the specific dependence on the difficult to measure, microscopic quantities N and (a). The rewritten microcracking elasticity theories are then compared to elasticity data on a variety of m icrocracked, polycrystalline ceramics.

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Section: Microcrack Density As a Function Of Grain Sizementioning

confidence: 99%

“…Heating from room temperature heals microcracks at sufficiently high temperatures [4], and subsequent cooling reopens microcracks [4][5][6][7][8].…”

Section: Microcrack Density As a Function Of Temperaturementioning

confidence: 99%

The effect of microcracking upon the Poisson's ratio for brittle materials

Case

1984

J Mater Sci

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“…Two possible mechanisms, adhesion and diffusional bonding, have been suggested to explain the crack healing of alumina ceramics at elevated temperatures. Adhesion is the re‐bonding of atoms on the interfaces of the fracture surfaces driven by their deviation from equilibrium .…”

Section: Resultsmentioning

confidence: 99%

“…35 Molecular dynamic simulation has revealed that the crack healing process can be promoted by compressive residual stress and accompanied with the generation and propagation of dislocations. [36][37][38] Two possible mechanisms, adhesion 39,40 and diffusional bonding, 19,20,41,42 have been suggested to explain the crack healing of alumina ceramics at elevated temperatures. Adhesion is the re-bonding of atoms on the interfaces of the fracture surfaces driven by their deviation from equilibrium.…”

Section: Microstructural Changes After Lsp and Annealingmentioning

confidence: 99%

Microstructure‐property relation in alumina ceramics during post‐annealing process after laser shock processing

et al. 2018

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Laser shock processing (LSP) is a new surface engineering approach to introduce significant compressive residual stress into ceramics to improve their mechanical properties. However, LSP of ceramics may induce microcracks, which limit the further improvement of mechanical properties of ceramics. In this research, the effect of a post‐LSP annealing process on α‐Al2O3 ceramics was investigated. The annealing treatment can cause thermal relaxation of compressive residual stress generated by LSP while still maintain the positive attribute of LSP. The compressive residual stress was stabilized after annealing after 10 hours at 1100‐1300°C. The healing of microcracks in α‐Al2O3 ceramics was observed during the post‐LSP annealing process, which is caused by diffusion bonding mechanisms and accompanied by dislocation and void formation. The combination of the stabilized compressive residual stress and microcrack healing can improve the cracking resistance of α‐Al2O3 ceramics to mechanical impact on the surface by 69%.

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“…On the other hand, healing is ubiquitous in biological systems, and it has been observed in polymers (Jud and Kausch 1979;Wool and O'Connor 1981;Jud et al 1981;Schapery 1989), ceramics (Lange and Gupta 1970;Gupta 1975;Evans and Charles 1977;Wiederhorn and Townsend 1970;Cook 1999;Chan and Page 1992), concrete (Jacobsen et al 1996) and rocks (Smith and Evans 1984). Furthermore, several healing mechanisms have been identified, and among them healing by diffusion appears to be the most common one Case et al (1983). Here we distinguish between healing and toughening mechanisms.…”

Section: Introductionmentioning

confidence: 96%

The resistance curve for subcritical cracks near the threshold

2010

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Thermodynamic analysis of brittle fracture specimens near the threshold developed by Rice (Thermodynamics of quasi-static growth of Griffith cracks, J Mech Phys Solid 26: [61][62][63][64][65][66][67][68][69][70][71][72][73][74][75][76][77][78] 1978) is extended to specimens undergoing microstructural changes. The proposed extension gives rise to a generalization of the threshold concept that mirrors the way the resistance curve generalizes the fracture toughness. In the absence of experimental data, the resistance curve near the threshold is constructed using a basic lattice model.

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Microcrack Healing During the Temperature Cycling of Single Phase Ceramics

Cited by 20 publications

References 83 publications

The effect of microcracking upon the Poisson's ratio for brittle materials

The effect of microcracking upon the Poisson's ratio for brittle materials

Microstructure‐property relation in alumina ceramics during post‐annealing process after laser shock processing

The resistance curve for subcritical cracks near the threshold

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