2008
DOI: 10.1109/jproc.2008.922564
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Microelectrodes, Microelectronics, and Implantable Neural Microsystems

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Cited by 309 publications
(202 citation statements)
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“…Some of most advanced silicon designs include double-sided, high-density arrays 29,102 , three-dimensional arrangements 43 , and integrated electronics 39,40,132 . Although the inherent brittleness of silicon is a concern for some clinical applications, its electrical, mechanical, and thermal properties offer the greatest design options and are supported by a wide range of commercial microfabrication tools.…”
Section: Substrate Materials and Microfabricationmentioning
confidence: 99%
“…Some of most advanced silicon designs include double-sided, high-density arrays 29,102 , three-dimensional arrangements 43 , and integrated electronics 39,40,132 . Although the inherent brittleness of silicon is a concern for some clinical applications, its electrical, mechanical, and thermal properties offer the greatest design options and are supported by a wide range of commercial microfabrication tools.…”
Section: Substrate Materials and Microfabricationmentioning
confidence: 99%
“…A sensor site and the surrounding stimulation site can be seen in Fig. 1b Besides the comparably large, planar in-vitro systems, which are in the focus of this contribution, there are also CMOS-based needle-type probes for recording and stimulation in vivo that have been pioneered at the University of Michigan [3,[29][30][31][32][33] and adopted by other groups ( Figure 2) [34][35][36][37]. Such electrode arrays are inserted into the living brain and facilitate advances in the understanding of the nervous system.…”
Section: Cmos High-density Systemsmentioning
confidence: 99%
“…Such electrode arrays are inserted into the living brain and facilitate advances in the understanding of the nervous system. Merged with onchip circuitry, signal processing, microfluidics, and wireless interfaces, they are forming the basis for a family of neural prostheses for the possible treatment of disorders, such as blindness, deafness, paralysis, severe epilepsy, and Parkinson's disease [31].…”
Section: Cmos High-density Systemsmentioning
confidence: 99%
“…For the fabrication of neural systems with high-density electrodes, precision machining is increasingly being replaced by microelectromechanical systems (MEMS) technologies (Alivisatos et al 2013). In general, these MEMS-based devices rely on polymers (Stieglitz et al 2005) or silicon Wise et al 2008) as substrate materials, with the latter enabling the co-integration of electrodes with complementary metal-oxide semiconductor (CMOS) integrated circuits performing data preprocessing and multiplexing tasks.…”
Section: Introductionmentioning
confidence: 99%