Microelectromechanical Systems-Based Electrostatic Field Sensor Using Pb(Zr,Ti)O<sub>3</sub> Thin Films

The present study describes the MEMS-based piezoelectric switch to activate the event-driven wireless sensor node for chicken health monitoring system. We have fabricated the switch composed of "S" shaped piezoelectric cantilever and proof mass, where the resonance is 24 Hz. When the switch has been vibrated at 4, 6, 8, and 12 Hz, which is close to the chicken movement frequency, the input vibration was converted into the resonant one through superharmonic resonance leading to enough voltage to activate event-driven operation.

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“…The microfabrication process is same as that reported in our previous study [6,7]. Figure 4 shows the process flow.…”

Section: Device Fabricationmentioning

confidence: 97%

Piezoelectric switch to activate event-driven wireless sensor node by several Hz of vibration

Kobayashi

Okada

Gang

et al. 2011

2011 16th International Solid-State Sensors, Actuators and Microsystems Conference

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“…The study on the resonant electric field microsensor began in the 1990s, to our knowledge. Since then, the electric field resolution is being improved, from 630 V/m to 20.4 V/m, by various innovative micro sense structures [ 22 , 23 , 24 , 25 , 26 , 27 , 28 , 29 , 30 , 31 , 32 , 33 , 34 , 35 , 36 , 37 ], under the parallel plate calibration. The electric field microchips were mostly exposed to the external environment for test, historically.…”

Section: Introductionmentioning

confidence: 99%

Resolution-Enhancing Structure for the Electric Field Microsensor Chip

Yang

Zhang

et al. 2021

Micromachines

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Electrostatic voltage is a vital parameter in industrial production lines, for reducing electrostatic discharge harms and improving yields. Due to such drawbacks as package shielding and low resolution, previously reported electric field microsensors are still not applicable for industrial static monitoring uses. In this paper, we introduce a newly designed microsensor package structure, which enhances the field strength inside the package cavity remarkably. This magnification effect was studied and optimized by both theoretical calculation and ANSYS simulation. By means of the digital synthesizer and digital coherent demodulation method, the compact signal processing circuit for the packaged microsensor was also developed. The meter prototype was calibrated above a charged metal plate, and the electric field resolution was 5 V/m, while the measuring error was less than 3 V, from −1 kV to 1 kV in a 2 cm distance. The meter was also installed into a production line and showed good consistency with, and better resolution than, a traditional vibratory capacitance sensor.

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“…A thin film PZT is widely utilized in piezoelectric MEMS devices such as gyros [4], inkjet heads [5], RF-MEMS switches [6], and ultrasonic transducers [7]. We have reported various kinds of piezoelectric devices including microscanners [8,9], self-sensitive microcantilevers [10,11], electrostatic field sensors [12,13], accelerometers [14,15], trigger switches for wireless sensor nodes [16,17], pyroelectric sensors [18], and energy harvesters [19,20]. Moreover, we have utilized MEMS-based piezoelectric microcantilevers to investigate the crystal structure [21,22] and fatigue behavior [23] of PZT thin films.…”

Section: Introductionmentioning

confidence: 99%

Ultra-Thin Piezoelectric Strain Sensor Array Integrated on a Flexible Printed Circuit Involving Transfer Printing Methods

et al. 2016

Self Cite

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In this paper, we present a novel sensor array manufacturing process that involves transfer printing methods using a chip mounter with a vacuum collet. Using these methods, one can mount not only ultra-thin microsensors but also microcontroller and amplifier chips required for sensor device fabrication. We successfully transfer-printed a very fragile MEMS-based 5-mm-long, 1-mm-wide, 5-µm-thick high-aspect-ratio ultra-thin PZT(1.9 µm)/Si(3 µm) strain sensor onto a flexible printed-circuit (FPC) substrate with etched Cu wiring. Then, we connected the sensor to the wiring by printing a conductive paste using a screen printer. Large ferroelectric polarization-voltage hysteresis curves were obtained even after the transfer printing process. Since an output voltage corresponding to the magnitude of the strain from the developed sensor was generated, it was confirmed that ultra-thin sensors could be integrated to the FPC substrate by these transfer and screen printing techniques without damage. The PZT thin films have shown 0.18 mV/µε of dynamic strain sensitivity according to the resonant vibration of the stainless plate.

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Microelectromechanical Systems-Based Electrostatic Field Sensor Using Pb(Zr,Ti)O₃ Thin Films

Cited by 45 publications

References 13 publications

Piezoelectric switch to activate event-driven wireless sensor node by several Hz of vibration

Piezoelectric switch to activate event-driven wireless sensor node by several Hz of vibration

Resolution-Enhancing Structure for the Electric Field Microsensor Chip

Ultra-Thin Piezoelectric Strain Sensor Array Integrated on a Flexible Printed Circuit Involving Transfer Printing Methods

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Microelectromechanical Systems-Based Electrostatic Field Sensor Using Pb(Zr,Ti)O3 Thin Films

Cited by 45 publications

References 13 publications

Piezoelectric switch to activate event-driven wireless sensor node by several Hz of vibration

Piezoelectric switch to activate event-driven wireless sensor node by several Hz of vibration

Resolution-Enhancing Structure for the Electric Field Microsensor Chip

Ultra-Thin Piezoelectric Strain Sensor Array Integrated on a Flexible Printed Circuit Involving Transfer Printing Methods

Contact Info

Product

Resources

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Microelectromechanical Systems-Based Electrostatic Field Sensor Using Pb(Zr,Ti)O₃ Thin Films