Microelectromechanical Systems (MEMS) Resistive Heaters as Circuit Protection Devices

Coutu, Ronald A.; Ostrow, Scott A.

doi:10.1109/tcpmt.2013.2282362

Cited by 7 publications

(3 citation statements)

References 7 publications

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“…For device applications, this prior history dependence of the piezoresistive behavior is generally undesired, but there are instances where this history dependence could be beneficial. This dependence on prior loading history could be a simple antitampering component 51 or determine if a device/product was subjected to undesired pressures at some time. However, as the piezoresistive behavior appears to reach a quasi-equilibrium state after three loading−unloading cycles, an initial "burn-in" period of 3+ cycles could be used to condition the material and increase the pressure sensitivity of the material.…”

Section: ■ Results and Discussionmentioning

confidence: 99%

Tunable Piezoresistivity from Magnetically Aligned Ni(Core)@Ag(Shell) Particles in an Elastomer Matrix

Peng

Chen

Yildirim

et al. 2019

ACS Appl. Mater. Interfaces

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Core−shell (Ni@Ag) particles are aligned through the thickness of a poly(dimethylsiloxane) (PDMS) film using a magnetic field in a continuous roll-to-roll process. The alignment of the particles dramatically decreases the percolation threshold for electrical conductivity through the thickness of the film by nearly an order of magnitude from 28 vol % without the field to ≈1 vol % with a 52 mT magnetic field during curing. However, the magnetic forces lead to rough surface topography for intermediate Ni@Ag loadings, but confining the Ni@Ag/PDMS composite by a glass constraint provides a smooth surface. This difference in geometry changes the morphology of the vertically aligned "chains" of Ni@Ag particles where the chains are more aggregated when the film is unconstrained. As the Ni@Ag concentration is decreased below 3.6% for the constrained film, breaks in the aligned particles evident from X-ray tomography lead to pressure sensitive resistance across that film with a large decrease in resistance above a threshold pressure. The threshold pressure is demonstrated to be controllable from ≈15 to ≈290 kPa through the loading of aligned Ni@Ag in the PDMS, but this threshold pressure decreases on cyclic loading. These magnetically aligned composites represent a facile route to mechanically responsive films that could be used in a variety of applications where cyclic loading above and below the threshold pressure is not required, such as disposable pressure sensors for ensuring reliability of products through transportation and embedded structural health monitoring for identifying critical displacements.

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Section: ■ Results and Discussionmentioning

confidence: 99%

Tunable Piezoresistivity from Magnetically Aligned Ni(Core)@Ag(Shell) Particles in an Elastomer Matrix

Peng

Chen

Yildirim

et al. 2019

ACS Appl. Mater. Interfaces

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“…Energy is transferred between them from a Fig. 1 Top view optical image of a same-length bimorph cantilever beam array and associated meandering resistor heater element [9] combination of electron diffusion and kinetic energy caused by vibrating lattice molecules [12,13]. The total rate of thermal conductivity varies depending on the material.…”

Section: Theorymentioning

confidence: 99%

“…The total rate of thermal conductivity varies depending on the material. For instance, most metals will have higher electron diffusion while non-metals primarily transfer heat through lattice vibration [12,13]. This lattice structure strongly encourages conductive energy transfer and is therefore typically the best method of heat transfer through solid materials even at the MEMS-scale.…”

Section: Theorymentioning

confidence: 99%

Thermal Management Using MEMS Bimorph Cantilever Beams

Coutu¹,

LaFleur²,

Walton³

et al. 2016

Exp Mech

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This paper examines a passive cooling technique using microelectromechanical systems (MEMS) for localized thermal management of electronic devices. The prototype was designed using analytic equations, simulated using finite element methods (FEM), and fabricated using the commercial PolyMUMPs™ process. The system consisted of an electronic device simulator (EDS) and MEMS bimorph cantilever beams (MBCB) array with beams lengths of 200, 250, and 300 μm that were tested to characterize deflection and thermal behavior. The specific beam lengths were chosen to actuate in response to heating associated with the EDS (i.e. the longest beams actuated first corresponding to the hottest portion of the EDS). The results show that the beams deflected as designed when thermally actuated and effectively transferred heat away via thermal conduction. The temperature when the beams reached Bnet-zero^deflection (i.e. uncurled and flat) was related to the initial deflection distance while the contact deflection temperature and rate of actuation was related to beam length. Initial beam deflections, after release, and contact temperatures, when fully actuated, were approximately 5.05, 9.45, 14.05 μm, and 231, 222, 216°C, respectively with the longer beams making contact first. This innovative passive thermal management system enables selective device cooling without requiring active control or forced convection to maintain steady-state operating temperatures for sensitive microelectronic devices.

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