Microelectronics packaging technology roadmaps, assembly reliability, and prognostics

Abstract

This paper reviews the industry roadmaps on commercial-off-the shelf (COTS) microelectronics packaging technologies covering the current trends toward further reducing size and increasing functionality. Due to the breadth of work being performed in this field, this paper presents only a number of key packaging technologies. The topics for each category were down-selected by reviewing reports of industry roadmaps including the International Technology Roadmap for Semiconductor (ITRS) and by surveying publications of the International Electronics Manufacturing Initiative (iNEMI) and the roadmap of association connecting electronics industry (IPC). The paper also summarizes the findings of numerous articles and websites that allotted to the emerging and trends in microelectronics packaging technologies. A brief discussion was presented on packaging hierarchy from die to package and to system levels. Key elements of reliability for packaging assemblies were presented followed by reliabilty definition from a probablistic failure perspective. An example was present for showing conventional reliability approach using Monte Carlo simulation results for a number of plastic ball grid array (PBGA). The simulation results were compared to experimental thermal cycle test data. Prognostic health monitoring (PHM) methods, a growing field for microelectronics packaging technologies, were briefly discussed. The artificial neural network (ANN), a data-driven PHM, was discussed in details. Finally, it presented inter-and extra-polations using ANN simulation for thermal cycle test data of PBGA and ceramic BGA (CBGA) assemblies.

An Overview of Non-Destructive Testing Methods for Integrated Circuit Packaging Inspection

“…According to IPC (the association connecting electronics industries) Roadmap for Interconnect Technology [ 27 ], simultaneous size reduction and performance improvement still remain as the main challenges of IC packaging [ 28 ]. It has been predicted that the structural size of IC packaging will be in the order of few nanometers in next several years [ 28 ]. Considering the aforementioned trend, the gap between the IC package size and the spatial resolution of the inspection methods is shown in Figure 3 in terms of volumetric pixel/element (voxel) size of the packaging.…”

Synthesis and Microwave Dielectric Properties of BBSZ-Zinc Silicate Based Material for LTCC Applications

“…Low-temperature co-fired ceramic (LTCC) technology is a key microwave circuit fabrication technology used for fabricating devices for wireless and telecommunication industries at the GHz frequency range. 1 Several types of microwave circuits and components have been reported in LTCC, which include radar circuits, antennas, Bluetooth modules, and frontend modules for mobile phones and wireless local area networks. 2 These devices are fabricated using well-established commercial LTCC materials.…”

“…2 These devices are fabricated using well-established commercial LTCC materials. 1 However, to cater to the ever-increasing demands of high-operating-frequency devices, multi-functionality, miniaturization together with high speeds, there is a need to focus on new LTCC materials with improved dielectric properties. Several ceramic materials are known to have very good dielectric properties, such as low dielectric constant (< 6) and dielectric loss factor in the range of 10 À5 , such as, for example, (Mg 0.9 Ni 0.1 ) 2 Al 4 Si 5 O 18 , NaAlSi 3 O 8 , Mg 2 P 2 O 7 , and K 0.67 Ba 0.33 Ga 1.33 Ge 2.67 O 8 .…”

Um simulador educacional para apoio ao projeto de sistemas computacionais: hardware, software e suas interfaces

“…A evolução tecnológica e a consequente alta escala de integração no projeto de circuitos digitais (CIs) têm disponibilizado soluções de hardware com alto poder computacional, associada a um aumento substancial da sua complexidade. Exemplos de tais dispositivos são: SoC e MPSoC (sistemas com múltiplos processadores em um único chip), dispositivos de eletrônica reconfigurável (FPGA), sensores inteligentes, dentre outros [Ghaffarian 2016].…”