2014
DOI: 10.1109/jmems.2014.2307882
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Microfabricated Thermally Isolated Low Work-Function Emitter

Abstract: In this paper, we report low work function mechanically and thermally robust microfabricated thermionic emitters. Conformal deposition of polycrystalline-silicon carbide (poly-SiC) was used to form stiff suspension legs with U-shaped cross sections, which increased the out-of-plane rigidity and helped to maintain a micrometer-scale gap between emitter and collector. The structurally robust poly-SiC suspended structure was coated with a thin tungsten layer to improve adhesion of a work function lowering coating… Show more

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Cited by 37 publications
(24 citation statements)
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“…Modern microfabrication techniques already enabled the development of thermally and electrically insulated spacers that withstand large temperature gradients. These techniques eventually enabled the experimental demonstration of micron-gap TIC 22,23 . Sub-micron separation distances were also experimentally realized using nano-spacers in the frame of near-field thermal radiation experiments [24][25][26][27] .…”
Section: Device Conceptmentioning
confidence: 99%
“…Modern microfabrication techniques already enabled the development of thermally and electrically insulated spacers that withstand large temperature gradients. These techniques eventually enabled the experimental demonstration of micron-gap TIC 22,23 . Sub-micron separation distances were also experimentally realized using nano-spacers in the frame of near-field thermal radiation experiments [24][25][26][27] .…”
Section: Device Conceptmentioning
confidence: 99%
“…The optimal gap depends on the emitter temperature and, in the present case with T E < 1100 °C, should be <5 µm . Microtechnology applied to dielectric materials (electrically and thermally insulating) can open the route to these reduced values of interelectrode gap …”
Section: Physical Properties Of Active Materialsmentioning
confidence: 99%
“…Therefore, to sustain inter-electrode insulation and micron-scale spacing, researchers previously used sparse and small-area microstructures in thermionic and thermophotovoltaic devices. Some small-scale area devices (< 1 mm 2 ) were only designed for radiative heating and therefore could not sustain significant compressive force 3,28,29 . For some centimeter-scale devices, spacers were designed around the perimeter of the electrodes 30–32 , but such device architectures were prone to shorting due to bowing or surface roughness at the unsupported center of the electrode.…”
Section: Introductionmentioning
confidence: 99%