2007
DOI: 10.1002/adma.200700300
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Microfabrication of a Diffractive Microlens Array on n‐GaAs by an Efficient Electrochemical Method

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Cited by 46 publications
(37 citation statements)
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“…57 The problem of diffusional shielding of individual electrodes was solved for a confined etchant layer technique by periodically renewing the solution between probes and sample and limiting the extension of the diffusion layer with a homogeneous scavenger reaction. 58 Barker et al reported a multielectrode for parallel SECM imaging that comprised a linear array of 16 individually addressable microelectrodes placed on a planar insulating chip. 59 10 μm diameter Pt microelectrodes were prepared by laying a nanometer-thick Pt layer over an insulating silicon nitride film, followed by the application of a second thin nitride film.…”
Section: ' Secm Scanning With Multiplexed Probesmentioning
confidence: 99%
“…57 The problem of diffusional shielding of individual electrodes was solved for a confined etchant layer technique by periodically renewing the solution between probes and sample and limiting the extension of the diffusion layer with a homogeneous scavenger reaction. 58 Barker et al reported a multielectrode for parallel SECM imaging that comprised a linear array of 16 individually addressable microelectrodes placed on a planar insulating chip. 59 10 μm diameter Pt microelectrodes were prepared by laying a nanometer-thick Pt layer over an insulating silicon nitride film, followed by the application of a second thin nitride film.…”
Section: ' Secm Scanning With Multiplexed Probesmentioning
confidence: 99%
“…The possible destruction and denaturalization of the intrinsic structure beneath the machining surface usually caused by highenergy beam machining can be avoided. In our laboratory the replication of complex 3D microstructures has been achieved on the surface of GaAs, Si, copper and nickel with a nano or sub-micro resolution [28][29][30][31].…”
Section: Introductionmentioning
confidence: 99%
“…In this paper we present an electrochemical bulk micromachining method named the confined etchant layer technique (CELT) [28][29][30][31][32] for micromachining titanium and its alloys. The fundamentals of CELT can be described as follows: The etchant is generated electrochemically on the surface of a machining tool or a mold with desired 3D microstructures.…”
Section: Introductionmentioning
confidence: 99%
“…Experimental section. The machining can be achieved when the distance between electrode and workpiece is lower than a threshold value (Jiang et al, 2005;Shi et al, 2005;Zhang et al, 2006;Tang et al, 2007;Ma et al, 2007;Zhang et al, 2007). It can achieve etching pattens with high resolution, if the electrode and the workpiece remains relative rest.…”
Section: Experimental and Simulationsmentioning
confidence: 99%