2020
DOI: 10.3390/met10040486
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Microfabrication of Ni-Fe Mold Insert via Hard X-ray Lithography and Electroforming Process

Abstract: In this research, a Ni-Fe mold insert for the efficient replication of high aspect-ratio microstructure arrays was fabricated via hard X-ray lithography and an electroforming process. For the X-ray exposure on a photoresist, a gold-based X-ray mask was prepared with conventional UV photolithography. The gold thickness was designed to be over 15 μm to prevent development underneath the absorber and to enhance the adhesion strength between the photoresist and substrate. By using the X-ray mask, a positive-type p… Show more

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Cited by 4 publications
(3 citation statements)
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“…Lithography includes many categories, such as electron beam lithography (EBL) [59], X-ray lithography [60], ion beam lithography (IBL) [19], grayscale lithography, and extreme ultraviolet (EUV) lithography [61]. EBL uses an electron beam to trace a pattern on the resist medium.…”
Section: Fabrication Methods Of Micro-structured Surfaces 21 Lithogra...mentioning
confidence: 99%
“…Lithography includes many categories, such as electron beam lithography (EBL) [59], X-ray lithography [60], ion beam lithography (IBL) [19], grayscale lithography, and extreme ultraviolet (EUV) lithography [61]. EBL uses an electron beam to trace a pattern on the resist medium.…”
Section: Fabrication Methods Of Micro-structured Surfaces 21 Lithogra...mentioning
confidence: 99%
“…Among them, the electrodeposited technology has the characteristics of low cost and industrial production convenience. It has been widely used to fabricate metal MEMS devices [ 7 , 8 , 9 ]. The electroplated Ni coating on carbon fiber can enhance the shielding effect of the sensor, which has the potential application of the MEMS pressure sensor [ 10 ].…”
Section: Introductionmentioning
confidence: 99%
“…Various methods have been proposed for nano-or micro-scale microfabrication techniques. Examples of these methods include removal processing such as etching [1][2][3][4], additional processing such as sputtering [5][6][7][8], composite processing such as the LIGA (named after the German acronym for lithography, electroplating, and molding) process [9][10][11], and assembly processing such as anode bonding [12][13][14]. Each method has its own characteristics and is used flexibly based on the processing accuracy, cost, and material selectivity.…”
Section: Introductionmentioning
confidence: 99%