Microfabrication using silicon mold inserts and hot embossing

Lin, Liwei; Chiu, Chun-Jung; Bache, W.; Heckele, M.

doi:10.1109/mhs.1996.563403

Cited by 14 publications

(5 citation statements)

References 6 publications

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“…The molding process can be conducted either in the laboratory or in a commercial environment [10]. For the laboratory process [13], hot embossing takes place under vacuum (about 0.1 mbar) to realize complete filling of the mold with PMMA of 300 µm in thickness. After evacuation, the mold is heated up to the molding temperature of 200 • C, which lies above the glass transition temperature of the polymer.…”

Section: Operation Principle and Manufacturing Methodsmentioning

confidence: 99%

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Silicon-processed plastic micropyramids for brightness enhancement applications

Lin

Shia

Chiu

2000

J. Micromech. Microeng.

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A combination of silicon anisotropic etch and mechanical hot embossing techniques is used to demonstrate the feasibility of manufacturing plastic micropyramids. These micropyramids have the desirable optical characteristics to enhance the brightness of LCD (liquid crystal displays) in battery-powered laptop computers, personal TVs and camcorders. Silicon mold inserts, 4-inch in diameter, are first micromachined and used directly in the micro hot embossing process by applying plastic sheets made of polymethyl methacrylate (PMMA) or polyvinyl chloride (PVC). Micropyramids which have base widths of 30 µm, heights of 21 µm and apex angles of 70 • are hot embossed on the surface of plastic sheets. The fabricated plastic films are tested optically and the results show that up to 20% brightness enhancement within the front viewing angles of ±35 • have been achieved. An optical model has been established to simulate the brightness enhancement effects and it is concluded that the optimal pyramid angle for the brightness enhancement application is 90 • .

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Section: Operation Principle and Manufacturing Methodsmentioning

confidence: 99%

“…In this case, the overall process takes only about 1 min and PVC is used as the plastic material. For every mold insert with different microstructures and different molding machines, adequate hot embossing parameters such as force, temperature and time have to be determined as described previously [10,13].…”

Section: Operation Principle and Manufacturing Methodsmentioning

confidence: 99%

Silicon-processed plastic micropyramids for brightness enhancement applications

Lin

Shia

Chiu

2000

J. Micromech. Microeng.

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“…the lab-on-a-chip [14,15]. As mentioned previously, polymer microfabrication by hot embossing is also becoming increasingly important as a lowcost alternative to silicon or glass-based MEMS technologies [16][17][18][19][20].…”

Section: Introductionmentioning

confidence: 99%

Fabrication of high-aspect-ratio polymer-based electrostatic comb drives using the hot embossing technique

Zhao

Cui

2003

J. Micromech. Microeng.

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We report on the formation of a lateral comb drive on poly-methyl-meth-acrylate (PMMA) using the hot embossing technique. A hot embossing mold insert is fabricated on a silicon wafer by means of lithography and inductive coupled plasma dry etching. The comb drive microstructure is hot embossed under a molding force of 35000 N at 130 • C. We demonstrate the comb drive, 80 units of interdigitated parallel capacitors with the finger gap and width both being 10 µm. The minimum feature size is 5 µm and the thickness of the structure is 60 µm, which makes the aspect ratio 12:1. The comb drive strokes 5 µm under an actuation potential of 180 V. We also present a brief description of the design and simulation with ANSYS.

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“…The laboratory process has been described in detail previously [Lin et al (1996)]. Figure 1 shows the summarized process steps.…”

Section: Laboratory Processmentioning

confidence: 99%

“…Previously, a laboratory hot embossing process which used silicon mold insert made by UV lithography and anisotropic silicon wet etching has been successfully developed [Lin et al (1996)]. Near perfect replication of microstructures has been demonstrated.…”

Section: Introductionmentioning

confidence: 99%

Comparative study of hot embossed micro structures fabricated by laboratory and commercial environments

Lin

Cheng

Chiu

1998

Microsystem Technologies

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Hot embossed microstructures fabricated by laboratory and commercial environments have been studied. The laboratory process uses silicon with micropyramid patterns as the mold insert. Fine replication by using Polymethyl Methacrylate (PMMA) has been achieved. The commercial process uses electroplated nickel as the mold insert. Polyvinyl Chloride (PVC), which has a lower glass transition point than PMMA, has been used as the raw material. Fabrication results show that the laboratory process, although taking about 2 hours long per run, can successfully replicate microstructures. The commercial process which takes only 1 minute per run may be fine tuned for good replication. Atomic Force Microscope (AFM) has been used to analyze the fabricated microstructures. It is found that the root mean square (r.m.s.) roughness of PMMA is about 4 nm and that of PVC is about 10-15 nm. Defects including voids and bumps on both PMMA and PVC films have been found.

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Microfabrication using silicon mold inserts and hot embossing

Cited by 14 publications

References 6 publications

Silicon-processed plastic micropyramids for brightness enhancement applications

Silicon-processed plastic micropyramids for brightness enhancement applications

Fabrication of high-aspect-ratio polymer-based electrostatic comb drives using the hot embossing technique

Comparative study of hot embossed micro structures fabricated by laboratory and commercial environments

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