2013 International Conference on Optoelectronics and Microelectronics (ICOM) 2013
DOI: 10.1109/icoom.2013.6626495
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Microfluidic device with compound structure

Abstract: The development of microfluidic chip has become a growing research field. Accompanied by the new polymer materials, the preparation process and the function of the microfluidic chip is becoming diversification. In this paper we propose a novel method for preparing microfluidic amperometric detection chip using the printed circuit board (PCB). The chip is consists of three parts: the printed circuit board substrate with micro-strip electrodes, the polymethyl methacrylate (PMMA) with microchannels and the PDMS a… Show more

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Cited by 1 publication
(2 citation statements)
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References 8 publications
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“…Innovative ideas have been proposed to solve the aforementioned problems. A popular solution is by using the vaporisation technique assisted by UV irradiation [91,92]. This technology was used in the fabrication of an amperometric chip by engraving a microchannel on the PMMA and then pairing this substrate with PCB through PDMS as the interfacing or planarization layer [92].…”
Section: Solvent Bondingmentioning
confidence: 99%
See 1 more Smart Citation
“…Innovative ideas have been proposed to solve the aforementioned problems. A popular solution is by using the vaporisation technique assisted by UV irradiation [91,92]. This technology was used in the fabrication of an amperometric chip by engraving a microchannel on the PMMA and then pairing this substrate with PCB through PDMS as the interfacing or planarization layer [92].…”
Section: Solvent Bondingmentioning
confidence: 99%
“…A popular solution is by using the vaporisation technique assisted by UV irradiation [91,92]. This technology was used in the fabrication of an amperometric chip by engraving a microchannel on the PMMA and then pairing this substrate with PCB through PDMS as the interfacing or planarization layer [92]. Although the bonding using this technique is generally effective for sealing, the principal problem is the difficulty of removing PDMS layers from the assembly, which can only be performed using sharp objects (e.g.…”
Section: Solvent Bondingmentioning
confidence: 99%