2017
DOI: 10.1063/1.4976690
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Microfluidic devices fabricated using fast wafer-scale LED-lithography patterning

Abstract: Current lithography approaches underpinning the fabrication of microfluidic devices rely on UV exposure of photoresists to define microstructures in these materials. Conventionally, this objective is achieved with gas discharge mercury lamps, which are capable of producing high intensity UV radiation. However, these sources are costly, have a comparatively short lifetime, necessitate regular calibration, and require significant time to warm up prior to exposure taking place. To address these limitations we exp… Show more

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Cited by 53 publications
(43 citation statements)
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“…Building up on a low cost UV light-emitting diode (LED) wafer scale mask aligner that enables sub-micron patterning with alignment resolution lower than 10 µm that we developed previously [10], we propose a low-cost version set-up with an Arduino based timer for single layer exposure.…”
Section: Photolithographymentioning
confidence: 99%
“…Building up on a low cost UV light-emitting diode (LED) wafer scale mask aligner that enables sub-micron patterning with alignment resolution lower than 10 µm that we developed previously [10], we propose a low-cost version set-up with an Arduino based timer for single layer exposure.…”
Section: Photolithographymentioning
confidence: 99%
“…Polydimethylsiloxane (PDMS) devices were produced on SU-8 moulds fabricated via photolithographic processes as described elsewhere, 30;31 with UV exposure performed with custom-built LED-based apparatus. 32 Following development of the moulds, feature heights were verified by profilometer (Dektak, Bruker) and PDMS (Dow Corning, primer and base mixed in 1:10 ratio) applied and degassed before baking at 65°C overnight. Devices were cut from the moulds and holes for tubing connection (0.75 mm) and electrode insertion (1.5 mm) were created with biopsy punches, the devices were cleaned by application of Scotch tape and sonication in IPA (5 min).…”
Section: Microfluidic Device Fabricationmentioning
confidence: 99%
“…The replica mould for the two-dimensional (2D) microfluidic devices was fabricated through a single, standard soft-lithography step 20,21 by spinning SU-8 3050 (MicroChem Corp.) photoresist onto a polished silicon wafer to a height of 50 µm and using a custom-built LEDbased apparatus for performing the UV exposure step. 22 The mould was used to generate poly(dimethylsiloxane) (PDMS; Dow Corning) based chips and the channels were sealed with a quartz slide (Alfa Aesar, 76.2 x 25.4 x 1.0 mm) after the surface had been activated through oxygen plasma (Diener electronic; 40% power for 15 seconds). The chips were exposed to an additional plasma oxidation step (80% power for 500 seconds) to render the channel surfaces more hydrophilic.…”
Section: Fabrication Of Two-dimensional Microfluidic Devicesmentioning
confidence: 99%