Microfluidic Interposer for High Performance Fluidic Chip Cooling

Steller, Wolfram; Windrich, Frank; Bremner, Douglas L.; Robertson, Stephen; Mrosko, Raul; Keller, J.; Brunschwiler, Thomas; Schlottig, Gerd; Oppermann, Hermann; Wolf, M. Jurgen; Lang, Klaus‐Dieter

doi:10.1109/estc.2018.8546344

Cited by 4 publications

(1 citation statement)

References 9 publications

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“…A similar design has been commonly used in LTCC (low-temperature co-fired ceramics) modules [31,32]. In a series of recent works, it was proposed to extend the thermal vias (like the metal pillars in this work) in ceramics into the coolant to obtain enhanced heat transfer [33][34][35]. Nevertheless, there is an inconvenient drawback to this technique: the large pressure drops, which involve high pumping power.…”

Section: Schematic Descriptionmentioning

confidence: 99%

Multiphysics Simulation of a Novel Self-Adaptive Chip Cooling with a Temperature-Regulated Metal Pillar Array in Microfluidic Channels

Xiang,

Yang,

Zhang

et al. 2023

Energies

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Conventional liquid cooling techniques may provide effective chip cooling but at the expense of high pumping power consumption. Considering that there is dynamic heat load in practice, a self-adaptive cooling technique is desired to reduce operational costs while preserving inherent cooling effectiveness. In this work, a novel self-adaptive cooling strategy is presented to balance the thermal and flow efficiency in accordance with the dynamic thermal load, based on temperature-regulated movement of the metal pillar array in a microfluidic channel. With an illustrative device, the effectiveness of such a strategy is investigated using multiphysics modeling and simulation. As a case study, the device is considered to be initiated with a chip power of 5 W and an inlet coolant velocity of 0.3 m/s. It is shown that the temperature-regulated movement of the metal pillar heat sink will be activated rapidly and equilibrate within 30 s. Parts of the metal pillars immerse into the coolant flow, resulting in significantly improved heat transfer efficiency. The diminished thermal resistance leads to a reduction in chip temperature rise from 225 K (without structural adaptation) to 91.86 K (with structural adaption). Meanwhile, the immersion of metal pillars into the coolant also causes an increased flow resistance in the microfluidic channel (i.e., pressure drop increases from 859.27 Pa to 915.98 Pa). Nevertheless, the flow resistance decreases spontaneously when the working power of the chip decreases. Comprehensive simulation has demonstrated that the temperature-regulated structure works well under various conditions. Therefore, it is believed that the presented self-adaptive cooling strategy offers simple and cost-effective thermal management for modern electronics with dynamic heat fluxes.

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